SD Flash Memory Card Manufacturing Using Rigid-Flex PCB
First Claim
1. A memory card device comprising:
- a printed circuit board assembly (PCBA) including;
a rigid-flex printed circuit board (PCB) having opposing first and second surfaces, the rigid-flex printed circuit board (PCB) including at least one rigid PCB section and at least one flexible PCB section connected to the at least one rigid PCB section, and a plurality of conductive traces forming signal paths between said at least one rigid PCB section and at least one flexible PCB section,a plurality of metal contacts disposed on the second surface of the rigid-flex PCB and connected to corresponding conductive traces of said plurality of conductive traces,at least one passive component mounted on the second surface of the rigid-flex PCB, andat least one unpackaged integrated circuit (IC) die mounted on the second surface of the rigid-flex PCB; and
a housing including;
a plastic upper housing portion defining one or more openings, wherein the PCBA is mounted into the upper housing portion such that said plurality of metal contacts are exposed through said one or more openings, anda molded casing comprising thermoset plastic formed over the second surface of the rigid-flex PCB such that said at least one passive component and said at least one IC die are encased by said thermoset plastic.
1 Assignment
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Accused Products
Abstract
A memory card (e.g., SD or MMC) device including a PCBA in which components are mounted on a “rigid-flex” PCB including at least one rigid PCB section and at least one flexible PCB section, and a housing that includes both a pre-molded upper housing portion and a molded casing. The rigid-flex PCB is mounted into the upper housing portion such that standard metal contacts disposed on an upper surface of the rigid-flex PCB are exposed through openings defined the upper housing portion, and such that the flexible section of the rigid-flex PCB over any contours formed on the inside surface of the upper housing portion. The molded casing is then formed by depositing thermoset plastic over the lower surface of rigid-flex PCB.
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Citations
20 Claims
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1. A memory card device comprising:
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a printed circuit board assembly (PCBA) including; a rigid-flex printed circuit board (PCB) having opposing first and second surfaces, the rigid-flex printed circuit board (PCB) including at least one rigid PCB section and at least one flexible PCB section connected to the at least one rigid PCB section, and a plurality of conductive traces forming signal paths between said at least one rigid PCB section and at least one flexible PCB section, a plurality of metal contacts disposed on the second surface of the rigid-flex PCB and connected to corresponding conductive traces of said plurality of conductive traces, at least one passive component mounted on the second surface of the rigid-flex PCB, and at least one unpackaged integrated circuit (IC) die mounted on the second surface of the rigid-flex PCB; and a housing including; a plastic upper housing portion defining one or more openings, wherein the PCBA is mounted into the upper housing portion such that said plurality of metal contacts are exposed through said one or more openings, and a molded casing comprising thermoset plastic formed over the second surface of the rigid-flex PCB such that said at least one passive component and said at least one IC die are encased by said thermoset plastic. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for producing a plurality of memory card devices, the method comprising:
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producing a printed circuit board (PCB) panel including a plurality of rigid-flex PCBS, each rigid-flex PCB including at least one rigid PCB section and at least one flexible PCB section, wherein a plurality of contact pins are formed on a lower surface of said each at least one rigid PCB section; attaching at least one passive component and at least one integrated circuit to an upper surface of each said rigid-flex PCB region; mounting the PCB panel into a molding apparatus such that said upper surface of each said rigid-flex PCB region is pressed against an upper wall of a corresponding upper housing portion such that said contact pins are exposed through at least one opening defined in said upper housing portion; forming a molded casing over the second surface of each rigid-flex PCB region such that said at least one passive component and said at least one IC die of each PCB region are covered by thermal set plastic; and singulating said PCB panel by cutting said PCB panel such that the PCB panel is separated into said plurality of memory card devices, wherein each memory card device includes a rigid-flex PCB region, a corresponding said upper housing portion, and a corresponding said molded upper housing portion. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification