LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF
First Claim
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1. A light emitting diode structure comprising:
- a silicon substrate having a cup-structure with a parabolic shape thereon and a plurality of through-holes at a bottom of the cup-structure penetrating the silicon substrate;
a reflective layer disposed on a top surface of the silicon substrate in the cup-structure;
a conductive layer filling up the through-holes at the bottom of the cup-structure and protruding out from the through-holes, wherein a part of the conductive layer protruding out from the through-holes is a base; and
a light emitting diode disposed on top of the base, wherein the light emitting diode is located at a focus of the cup-structure.
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Abstract
A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.
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Citations
17 Claims
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1. A light emitting diode structure comprising:
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a silicon substrate having a cup-structure with a parabolic shape thereon and a plurality of through-holes at a bottom of the cup-structure penetrating the silicon substrate; a reflective layer disposed on a top surface of the silicon substrate in the cup-structure; a conductive layer filling up the through-holes at the bottom of the cup-structure and protruding out from the through-holes, wherein a part of the conductive layer protruding out from the through-holes is a base; and a light emitting diode disposed on top of the base, wherein the light emitting diode is located at a focus of the cup-structure. - View Dependent Claims (2, 3, 4, 5)
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6. A method of fabricating a light emitting diode comprising:
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providing a silicon substrate; fabricating a plurality of through-holes on a bottom surface of the silicon substrate; forming a conductive layer on the bottom surface of the silicon substrate, and filling the through-holes with the conductive layer to form a base; fabricating a cup-structure having a parabolic shape on a top surface of the silicon substrate, and exposing the base to protrude out from a bottom of the cup-structure; forming a reflective layer on the top surface of the silicon substrate in the cup-structure; and bonding a light emitting diode on the base at a focus of the cup-structure. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification