DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, MOTHERBOARD FOR MANUFACTURING THE SAME AND METHOD FOR MANUFACTURING A DISPLAY SUBSTRATE FOR THE SAME

• US 20080198287A1
• Filed: 02/19/2008
• Published: 08/21/2008
• Est. Priority Date: 02/20/2007
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Jung, Kwan-Wook, Tae, Seung-Gyu, Kim, Hyun-Young, Na, Hyung-Don, Kim, Jung-Yun
• Granted Patent: US 7,952,679 B2
• Time in Patent Office: Days
• US Class Current: 349/42
• CPC Class Codes: G02F 1/133357 Planarisation layers
• CPC Class Codes: G02F 1/1339 Gaskets; Spacers; Sealing of cells
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence
• CPC Class Codes: G02F 2202/02 organic material

Abstract

A display panel includes a first substrate, a thin-film transistor (TFT), an organic layer, a second substrate, a seal line, and a conductive pattern. The first substrate includes a pixel part and a driving part connected to the pixel part. The TFTs are formed in the pixel part and the driving part. The organic layer is formed on the first substrate having the TFTs formed thereon. The second substrate is opposite to the first substrate. The seal line is disposed between an edge portion of the first substrate having the organic layer formed thereon and an edge portion of the second substrate. The seal line combines the first substrate with the second substrate. The conductive pattern is disposed between the seal line and the organic layer.

Claims

1. A display panel comprising:

a first substrate including a pixel part and a driving part connected to the pixel part;

thin-film transistors (TFTs) formed in the pixel part and the driving part;

an organic layer formed on the first substrate having the TFTs formed thereon;

a second substrate facing the first substrate;

a seal line disposed between an edge portion of the first substrate and an edge portion of the second substrate, wherein the seal line combines the first substrate with the second substrate; and

a conductive pattern disposed between the seal line and the organic layer.

2. The display panel of claim 1, wherein the conductive pattern comprises a material having a greater adhesive strength against the seal line than the organic layer.

3. The display panel of claim 2, wherein the conductive pattern comprises a metal or a metal oxide.

4. The display panel of claim 1, wherein the first substrate further comprises a pixel electrode formed on the organic layer corresponding to the pixel part and the conductive pattern is formed from a same layer as the pixel electrode.

5. The display panel of claim 4, wherein the conductive pattern comprises indium tin oxide (ITO) or indium zinc oxide (IZO).

6. The display panel of claim 1, wherein the conductive pattern overlaps the seal line.

7. The display panel of claim 1, wherein the conductive pattern is formed on the driving part.

8. The display panel of claim 7, wherein the driving part comprises a gate driver to drive the TFT in the pixel part and overlaps the seal line.

9. The display panel of claim 1, wherein a hole passes through the organic layer corresponding to the driving part and the conductive pattern is disposed between the seal line and the driving part in a region corresponding to the hole.

10. The display panel of claim 1, further comprising a liquid crystal layer interposed between the first and second substrates and sealed by the seal line.

11. The display panel of claim 4, wherein the second substrate comprises:

a black matrix to cover the seal line and the driving part; and

a common electrode opposite to the pixel electrode.

12. A method for manufacturing a display panel, comprising:

forming TFTs in a pixel part of a first substrate and a driving part of the first substrate, wherein the driving part is connected to the pixel part;

forming an organic layer on the first substrate having the TFTs formed thereon;

forming a conductive pattern on a portion of the organic layer;

disposing a second substrate facing the first substrate; and

forming a seal line partially overlapping the conductive pattern between an edge portion of the first substrate and an edge portion of the second substrate to combine the first substrate with the second substrate.

13. The method of claim 12, wherein the conductive pattern is formed from a same layer as a pixel electrode formed on the organic layer corresponding to the pixel part of the first substrate.

14. A motherboard for manufacturing a display substrate, comprising:

a substrate including a plurality of display substrate areas, each of the display substrate areas including a pixel part and a driving part connected to the pixel part;

TFTs formed in the pixel part and the driving part;

an organic layer formed on the substrate having the TFTs formed thereon; and

a guide ring formed on the organic layer,

wherein the guide ring comprises a conductive pattern disposed on the organic layer corresponding to the driving part and a first connection part connecting adjacent conductive patterns in a ring shape, the adjacent conductive patterns being respectively disposed on different display substrate areas from each other.

15. The motherboard of claim 14, further comprising a pixel electrode formed on the organic layer corresponding to the pixel part, wherein the guide ring is formed from substantially the same layer as the pixel electrode.

16. The motherboard of claim 14, further comprising a second connection part disposed between the display substrate areas, extended in a direction different from an extended direction of the first connection part, and electrically connected to the first connection part.

17. The motherboard of claim 16, wherein the second connection part is formed from a same layer as the guide ring.

18. The motherboard of claim 16, wherein the second connection part is formed from substantially the same metal layer as the TFT.

19. A method for manufacturing a display substrate, comprising:

forming TFTs in a pixel part and a driving part of a base substrate;

forming an organic layer on the base substrate having the TFTs formed thereon; and

forming a guide ring including a conductive pattern disposed on the organic layer corresponding to the driving part and a first connection part connecting adjacent conductive patterns in a ring shape, the adjacent conductive patterns being formed in the display substrate areas different from each other.

20. The method of claim 19, wherein the guide ring comprises a metal or a metal oxide.

21. The method of claim 19, wherein the guide ring is formed from a same layer as a pixel electrode formed on the organic layer corresponding to the pixel part.

22. The method of claim 21, wherein the guide ring comprises indium tin oxide (ITO) or indium zinc oxide (IZO).

23. The method of claim 19, wherein forming a guide ring comprises connecting the first connection part with a second connection part disposed between the display substrate areas and extended in a direction different from an extended direction of the first connection part to cross the first connection part.

24. The method of claim 23, wherein the second connection part comprises a same material as the guide ring, and is formed from substantially the same layer as the guide ring.

25. The method of claim 23, wherein the second connection part is formed from substantially the same metal layer as the TFT.