POLISHING METHOD OF SEMICONDUCTOR SUBSTRATE

• US 20080200032A1
• Filed: 02/19/2008
• Published: 08/21/2008
• Est. Priority Date: 02/20/2007
• Status: Abandoned Application

• Current Assignee: Araca, Inc., Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Original Assignee: Araca, Inc., Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Inventors: ZHUANG, Yun, NISHIYAMA, Masaya, PHILIPOSSIAN, Ara, SUDARGHO, Fransisca, ASHIZAWA, Toranosuke, SAMPURNO, Yasa Adi
• Application Number:
  US12/033,381
• Publication Number:
  US 20080200032A1
• Time in Patent Office: Days
• US Class Current: 438/690
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 37/042 operating processes therefor
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: H01L 21/31053 involving a dielectric removal step
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

The present invention relates to a method of polishing a semiconductor substrate, comprising pressing a semiconductor substrate having a film to be polished that is held by a carrier onto a polishing cloth fixed on a revolving polishing table and supplying a polishing slurry to the space between the polishing cloth and the semiconductor substrate, wherein the end point of polishing is determined according to the change in the friction coefficient while the friction coefficient between the semiconductor substrate and the polishing cloth is measured. According to the present invention it is possible to measure friction coefficient accurately in polishing a semiconductor substrate and use the change thereof to determine the end point of polishing.

Claims

1. A method of polishing a semiconductor substrate, comprising pressing a semiconductor substrate having a film to be polished that is held by a carrier onto a polishing cloth fixed on a revolving polishing table and supplying a polishing slurry to the space between the polishing cloth and the semiconductor substrate, wherein the end point of polishing is determined according to the change in the friction coefficient while the friction coefficient between the semiconductor substrate and the polishing cloth is measured.

2. The method of polishing a semiconductor substrate according to claim 1, wherein the friction coefficient is determined from the shearing force applied to the polishing cloth and the semiconductor substrate by polishing.

3. The method of polishing a semiconductor substrate according to claim 2, wherein the shearing force is detected as two forces mutually rectangular to each other in the horizontal direction transmitted to the carrier or polishing table.

4. The method of polishing a semiconductor substrate according to claim 2, wherein the end point of polishing is identified by extracting frequency components by fast Fourier transformation of the shearing force and determining the intensity change of each extracted frequency component.

5. The method of polishing a semiconductor substrate according to claim 1, comprising exposing a different film to be polished during polishing, wherein the ratio of the polishing rate RR2 of the newly exposed film to be polished to the polishing rate RR1 of the film exposed on the semiconductor substrate surface immediately therebefore, RR1/RR2, is 10 or more.

6. The method of polishing a semiconductor substrate according to claim 1, wherein the surface of the film to be polished is irregular when polishing is initiated.

7. The method of polishing a semiconductor substrate according to claim 1, wherein a polishing slurry containing cerium oxide particles and ammonium polyacrylate or an ammonium acrylate copolymer is used.

8. The method of polishing a semiconductor substrate according to claim 1, wherein the film to be polished contains silicon oxide and silicon nitride.