Broadband RF connector interconnect for multilayer electronic packages

• US 20080200068A1
• Filed: 02/21/2007
• Published: 08/21/2008
• Est. Priority Date: 02/21/2007
• Status: Active Grant

• Current Assignee: Kyocera America Incorporated (Kyocera Corporation)
• Original Assignee: Kyocera America Incorporated (Kyocera Corporation)
• Inventors: Aguirre, Gerardo
• Granted Patent: US 7,808,341 B2
• Time in Patent Office: Days
• US Class Current: 439/583
• CPC Class Codes: H01P 5/085 Coaxial-line/strip-line transitions
• CPC Class Codes: H01R 2103/00 Two poles
• CPC Class Codes: H01R 24/44 comprising impedance matching means

Abstract

A coaxial transition arrangement including a coaxial connector for connecting a coaxial cable to a multilayer package has an improved coaxial connector for accomplishing impedance matching and providing improved broadband performance. Impedance matching is provided by a metal disk structure comprising a plurality of metal disks mounted on a center conductor pin of the coaxial connector. The disks are mounted in spaced-apart relation on the center conductor pin and have different radiuses which decrease with increasing distance from the base of the center conductor pin. The coaxial connector has a shroud which is configured to accommodate the metal disk structure therein, as does the ring of ground vias forming a part of the multilayer package.

Claims

1. A coaxial connector having a center conductor pin surrounded by a shroud, the connector having a plurality of conductive disks of different size mounted in space-apart fashion on the center conductor pin to provide impedance matching.

2. The invention set forth in claim 1, wherein the plurality of conductive disks are comprised of relatively thin metal disks of different radii.

3. The invention set forth in claim 1, further including a multilayer package having the coaxial connector mounted thereon.

4. The invention set forth in claim 3, wherein the multilayer package includes a stack of ceramic layers and the center conductor pin has a braze pad at a base thereof brazed to the stack of ceramic layers.

5. The invention set forth in claim 3, wherein the center conductor pin has a base thereof mounted on the multilayer package and the plurality of conductive disks comprise three metal disks which have decreasing diameters with increasing distance from the multilayer package.

6. The invention set forth in claim 3, wherein the multilayer package includes a ring of ground vias having an aperture therein for receiving the center conductor pin therein.

7. The invention set forth in claim 3, further including a coaxial cable connected to the coaxial connector.

8. A coaxial transition arrangement comprising the combination of:

a multilayer package;

a coaxial cable; and

a coaxial connector coupling the multilayer package to the coaxial 5 cable, the coaxial conductor including a center conductor pin having a metal disk structure thereon, the metal disk structure providing impedance matching.

9. The invention set forth in claim 8, wherein the metal disk structure includes a plurality of metal disks of different size mounted in spaced-apart relation along the center conductor pin.

10. The invention set forth in claim 9, wherein the center conductor pin has a base coupled to the multilayer package and the plurality of metal disks have decreasing diameters with increasing distance from the multilayer package.

11. The invention set forth in claim 8, wherein the coaxial connector includes a shroud mounted on the multilayer package, surrounding the center conductor pin and the metal disk structure thereon and receiving the coaxial cable therein.