Method of manufacturing a piezoelectric package having a composite structure

• US 20080202664A1
• Filed: 02/27/2008
• Published: 08/28/2008
• Est. Priority Date: 02/27/2007
• Status: Abandoned Application

• Current Assignee: Iptrade Limited
• Original Assignee: Iptrade Limited
• Inventors: Kessenich, Grace R., Pletner, Baruch
• Application Number:
  US12/038,789
• Publication Number:
  US 20080202664A1
• Time in Patent Office: Days
• US Class Current: 156/60
• CPC Class Codes: F16F 2224/0283 piezoelectric; electro- or magnetostrictive
• CPC Class Codes: H10N 30/00 Piezoelectric or electrostrictive devices integrated devices or assemblies of multiple devices H10N39/00
• CPC Class Codes: H10N 30/02 Forming enclosures or casings
• CPC Class Codes: H10N 30/88 Mounts; Supports; Enclosures; Casings
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A piezoelectric package comprises a piezoelectric plate having a first planar surface and a second planar surface that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer electrically coupled to the first planar surface, and a second electrically conductive layer electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (e.g., a rigid fiber composite material) encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.

Claims

1. A method of manufacturing a piezoelectric package, comprising:

disposing a first composite sheet relative to a first electrically conductive sheet;

disposing a first planar surface of a piezoelectric plate relative to the first electrically conductive sheet;

disposing a second electrically conductive sheet relative to a second planar surface of the piezoelectric plate opposite the first planar surface;

disposing a second composite sheet relative to the second electrically conductive sheet, wherein a laminate structure of the first and second composite sheets, the first and second electrically conductive sheets, and the piezoelectric plate is formed; and

heating the laminate structure, wherein the first and second composite sheets polymerize in response to the heating to transform the laminate structure into an integrated composite structure, and the first and second electrically conductive sheets are respectively electrically coupled to first and second planar surfaces of the piezoelectric plate.

2. The method of claim 1, further comprising mounting a connector assembly to the integrated composite structure in electrical communication with the first and second electrically conductive sheets.

3. The method of claim 2, wherein portions of the first and second electrically conductive sheets are respectively left exposed in the laminate structure, and wherein first and second terminals of the connector assembly are respectively coupled to the exposed portions of the first and second electrically conductive sheets.

4. The method of claim 1, wherein first and second surface electrodes respectively cover the first and second planar surfaces, and wherein the first and second electrically conductive sheets are respectively electrically coupled to the first and second planar surfaces via the first and second surface electrodes.

5. The method of claim 1, wherein the first and second electrically conductive sheets span the first and second planar surfaces.

6. The method of claim 1, wherein the first and second composite sheets comprise a fiber matrix impregnated with a resin.

7. The method of claim 6, wherein the fiber matrix comprises fiber glass and the resin comprises epoxy.

8. The method of claim 6, wherein the first and second electrically conductive sheets are composed of a porous material, and the resin of the first and second composite sheets flow into the porous material when the laminate structure is heated.

9. The method of claim 8, wherein the porous material is mesh.

10. The method of claim 1, wherein the first and second composite sheets are composed of an electrically insulative material.

11. The method of claim 1, further comprising disposing a third composite sheet between the first and second electrically conductive sheets to further form the laminate structure, wherein the third composite sheet has a window in which the piezoelectric plate is disposed, and wherein the third composite sheet polymerizes in response to the heating to transform the laminate structure into the integrated composite structure.

12. The method of claim 11, further comprising:

disposing a fourth composite sheet between the first electrically conductive sheet and the third composite sheet, wherein the fourth composite sheet has a window aligned with the first planar surface of the piezoelectric plate;

disposing a third electrically conductive sheet within the window of the fourth composite sheet;

disposing a fifth composite sheet between the second electrically conductive sheet and the third composite sheet, wherein the fifth composite sheet has a window aligned with the second planar surface of the piezoelectric plate; and

disposing a fourth electrically conductive sheet within the window of the fifth composite sheet to further form the laminate structure, wherein the fourth and fifth composite sheets polymerize in response to the heating to transform the laminate structure into the integrated composite structure, and wherein the first and second electrically conductive sheets are respectively electrically coupled to the first and second planar surfaces via the third and four electrically conductive sheets.

13. The method of claim 1, wherein the areas of the windows of the fourth and fifth electrically composite sheets are respectively less than the areas of the first and second planar surfaces of the piezoelectric plate.

14. The method of claim 1, wherein the integrated composite structure is rigid.

15. The method of claim 1, wherein the laminate structure is heated to a temperature above room temperature.