Chip bonding tool and related apparatus and method

• US 20080202677A1
• Filed: 05/30/2007
• Published: 08/28/2008
• Est. Priority Date: 02/28/2007
• Status: Active Grant

• Current Assignee: Hanwha Precision Machinery Co., Ltd. (Hanwha Corporation)
• Original Assignee: Samsung Techwin Corporation (Hanwha Corporation)
• Inventors: Ok, Ji-Tae
• Granted Patent: US 7,886,796 B2
• Time in Patent Office: Days
• US Class Current: 156/272.8
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers

Abstract

A chip bonding tool, related apparatus and a method thereof. The chip bonding tool includes a pressing block, through which a laser beam passes, for pressing a semiconductor chip; and a projection disposed under the pressing block, through which the laser beam passes, onto which the semiconductor chip is sucked, which spaces the pressing block from the semiconductor chip.

Claims

1. A chip bonding tool comprising:

a pressing block, through which a laser beam passes, for pressing a semiconductor chip; and

a projection disposed under the pressing block, through which the laser beam passes, onto which the semiconductor chip is sucked, which maintains a space between the pressing block and the semiconductor chip.

2. The chip bonding tool according to claim 1, wherein the pressing block has a width greater than that of the semiconductor chip, and the projection has a width smaller than that of the semiconductor chip.

3. The chip bonding tool according to claim 1, wherein a lower surface of the projection in contact with the semiconductor chip is disposed within an upper surface of the semiconductor chip.

4. The chip bonding tool according to claim 1, wherein the pressing block and the projection are formed of a transparent material.

5. The chip bonding tool according to claim 1, wherein the projection is separately formed from the pressing block.

6. The chip bonding tool according to claim 1, wherein the projection is formed at a lower surface of the pressing block in a stepped manner.

7. The chip bonding tool according to claim 1, wherein the projection is integrally formed with the pressing block.

8. The chip bonding tool according to claim 1, wherein a plurality of projections are formed at predetermined intervals.

9. A chip bonding apparatus comprising:

a stage for supporting a substrate;

a pressing block, through which a laser beam passes, for pressing a semiconductor chip; and

a projection disposed under the pressing block, through which the laser beam passes, onto which the semiconductor chip is sucked, which maintains a space between the pressing block and the semiconductor chip.

10. The chip bonding apparatus according to claim 9, wherein the pressing block and the projection have a vacuum hole for sucking the semiconductor chip.

11. The chip bonding apparatus according to claim 9, wherein the pressing block has a width relatively greater than or equal to that of the semiconductor chip, and the projection has a width relatively smaller than that of the semiconductor chip.

12. The chip bonding apparatus according to claim 9, wherein the projection is separately formed from the pressing block.

13. The chip bonding apparatus according to claim 9, wherein the projection is formed at a lower surface of the pressing block in a stepped manner.

14. The chip bonding apparatus according to claim 9, wherein the projection is integrally formed with the pressing block.

15. The chip bonding apparatus according to claim 9, wherein a plurality of projections are formed at predetermined intervals.

16. A chip bonding method comprising:

applying an adhesive agent to a substrate, and sucking a semiconductor chip to a lower surface of a projection using a suction module such that a pressing block is spaced apart from the semiconductor chip;

moving the pressing block downward;

aligning the semiconductor chip to the substrate; and

radiating a laser beam to cure the adhesive agent applied to the substrate.

17. The chip bonding method according to claim 16, wherein, when the semiconductor chip is aligned to the substrate, after detecting positions of the semiconductor chip and the substrate,

a terminal of the semiconductor chip is in contact with a terminal of the substrate, and the semiconductor chip is pressed downward.

18. The chip bonding method according to claim 16, wherein the pressing block has a width relatively greater than or equal to that of the semiconductor chip, and the projection has a width relatively smaller than that of the semiconductor chip.

19. The chip bonding method according to claim 16, wherein the projection is separately formed from the pressing block.