SHIELDING DEVICE

• US 20080202806A1
• Filed: 04/22/2008
• Published: 08/28/2008
• Est. Priority Date: 03/01/2006
• Status: Active Grant

• Current Assignee: Sony Ericsson Mobile Communications AB (Sony Group Corp.)
• Original Assignee: Sony Ericsson Mobile Communications AB (Sony Group Corp.)
• Inventors: Holmberg, Per
• Granted Patent: US 7,955,464 B2
• Time in Patent Office: Days
• US Class Current: 174/384
• CPC Class Codes: H05K 9/0032 having multiple parts, e.g. frames mating with lids

Abstract

A shielding device configured to provide EMI or ESD protection to an electronic component (80) comprises a cover (83), and a wall (10) of a resilient material. By molding the resilient material under the influence of a magnetic field provided by a number of separate magnets, a dispersed plurality of magnetically attractable particles in the material are concentrated in strings (11) extending between a lower (12) and upper (13) end of the wall. The cover is attached to connect to the strings affixed in the solidified wall at the upper end of the wall, and at the lower end of the wall the strings are placed in contact with a ground trace (82) formed around the component to be shielded, thereby forming a Faraday cage about the component.

Claims

1. A method for manufacturing a shielding device including a wall and a cover connected to an upper end of the wall, the method comprising:

injecting a moldable material, including a dispersed plurality of particles of a magnetically attractable material, into a cavity of a mold tool;

forming a magnetic field through the mold tool to cause the particles to be concentrated into strings extending through the moldable material within the cavity of the mold tool; and

solidifying the moldable material to form a resilient molded wall in which the particle strings are fixated extending from a lower wall to the upper end of the molded wall.

2. The method of claim 1, further comprising:

releasing the molded wall from the mold tool; and

connecting the cover to the molded wall.

3. The method of claim 1, further comprising:

releasing the molded wall from the mold tool; and

connecting the cover to the molded wall using a conductive adhesive.

4. The method of claim 1, further comprising:

releasing the molded wall from the mold tool; and

connecting the cover to the molded wall by pressing the cover and the molded wall together and so that a conductive layer of the cover is connected to the particle strings at the upper end of the molded wall.

5. The method of claim 1, further comprising:

placing the cover in the mold tool;

connecting the moldable material to the cover during solidification of the molding material when forming the molded wall; and

releasing the molded wall with the connected cover from the mold tool.

6. The method of claim 1, further comprising:

connecting the lower end of the molded wall to a ground portion of a carrier surface; and

connecting the cover to the molded wall so that a conductive layer of the cover is connected to the particle strings at the upper end of the molded wall.

7. The method of claim 6, wherein the connection of the cover to the molded wall is carried out before connection of the lower end of the molded wall to the ground portion of the carrier surface.

8. The method of claim 6, wherein connecting the lower end of the molded wall to a ground portion of a carrier surface comprises:

enclosing side surfaces and a top surface of a component attached to the carrier surface with the molded wall and the cover.

9. A method for shielding a component, the method comprising:

providing a wall of a resilient moldable material, the wall having a lower end and an upper end, and the wall encloses a plurality of particles of a magnetically attractable material that are concentrated in strings extending from the lower end to the upper end of the wall;

providing a cover having an electrically conductive layer, the cover connected to the particle strings at the upper end of the wall;

placing the wall on a carrier surface on which a component is attached, and so that a ground portion on the carrier surface is connected to the particle strings at the lower end of the wall.

10. The method of claim 9, wherein the wall, the ground portion of the carrier surface, and the cover enclose the component.

11. The method of claim 9, further comprising:

connecting the cover to the wall using a releasable attachment member that is configured to press the cover against the upper end of the wall.

12. The method of claim 9, further comprising:

connecting the cover to the wall using a conductive adhesive.

13. The method of claim 9, further comprising:

connecting the wall to the carrier surface using a releasable attachment member that is configured to press the wall against the ground portion of the carrier surface.