Stacked process chambers for substrate vacuum processing tool
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Abstract
A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. At least two of the process chamber modules are horizontally clustered around the substrate transfer chamber. In addition, at least two of the process chamber modules are vertically arranged with one process chamber module above the other process chamber module. The substrate transfer chamber includes one or more robotic arms for transferring semiconductor substrates between the substrate load lock chamber and the plurality of process chamber modules.
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Citations
48 Claims
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1-23. -23. (canceled)
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24. A semiconductor substrate processing apparatus, comprising:
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a substrate load lock chamber; a substrate transfer chamber vacuum coupled to the substrate load lock chamber; a plurality of process chamber modules vacuum coupled to the substrate transfer chamber, wherein at least two of the process chamber modules are horizontally clustered around the substrate transfer chamber, and at least two of the process chamber modules are vertically arranged with one process chamber module above the other process chamber module; and wherein the substrate transfer chamber comprises one or more robotic arms for transferring semiconductor substrates between the substrate load lock chamber and the plurality of process chamber modules. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A semiconductor substrate processing apparatus, comprising:
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a substrate load lock chamber; a substrate transfer chamber vacuum coupled to the substrate load lock chamber; a plurality of process chamber modules vacuum coupled to the substrate transfer chamber, wherein the plurality of process modules are arranged in a horizontal cluster of vertically stacked process modules around the substrate transfer chamber; and wherein the substrate transfer chamber comprises one or more robotic arms for transferring semiconductor substrates between the substrate load lock chamber and the plurality of process chamber modules. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47)
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48-255. -255. (canceled)
Specification