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Component, Power Component, Apparatus, Method Of Manufacturing A Component, And Method Of Manufacturing A Power Semiconductor Component

  • US 20080203550A1
  • Filed: 03/13/2007
  • Published: 08/28/2008
  • Est. Priority Date: 02/27/2007
  • Status: Active Grant
First Claim
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1. A component, comprising:

  • a device carrier;

    a device applied to the device carrier;

    a first conducting layer grown onto the device and onto the device carrier; and

    an insulating material applied to the first conducting layer such that only a portion of the first conducting layer is covered.

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