Through-Wafer Interconnection
First Claim
1. A method for fabricating through-wafer interconnects in a microelectronic structure, the method comprising the steps of:
- providing a conductive wafer having a front side and a backside;
forming a patterned trench in the conductive wafer by removing material of the conductive wafer, wherein the patterned trench has an annular circumferential opening generally dividing the conductive wafer along the opening into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor; and
adding a filler material into the patterned trench.
4 Assignments
0 Petitions
Accused Products
Abstract
A through-wafer interconnect and a method for fabricating the same are disclosed. The method starts with a conductive wafer to form a patterned trench by removing material of the conductive wafer. The patterned trench extends in depth from the front side to the backside of the wafer, and has an annular opening generally dividing the conductive wafer into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor. A dielectric material is formed or added into the patterned trench mechanical to support and electrically insulate the through-wafer conductor. Multiple conductors can be formed in an array.
127 Citations
64 Claims
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1. A method for fabricating through-wafer interconnects in a microelectronic structure, the method comprising the steps of:
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providing a conductive wafer having a front side and a backside; forming a patterned trench in the conductive wafer by removing material of the conductive wafer, wherein the patterned trench has an annular circumferential opening generally dividing the conductive wafer along the opening into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor; and adding a filler material into the patterned trench. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method for fabricating through-wafer interconnects in a microelectronic structure, the method comprising the steps of:
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providing a conductive wafer having a front side and a backside; and forming a patterned trench in the conductive wafer by removing material of the conductive wafer, wherein, (a) the patterned trench has an annular circumferential opening generally dividing the conductive wafer along the opening into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor; and (b) at least a portion of the patterned trench is further fine-patterned within trench opening with open passages interlined with lines of unremoved conductive wafer material. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A method for fabricating through-wafer interconnects in a microelectronic structure, the method comprising the steps of:
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bonding a first conductive wafer and a second conductive wafer such that a bottom side of the first conductive wafer contacting a top side of the second conductive wafer; forming a first portion of a patterned trench through a top side of the first conductive wafer; and forming a second portion of the patterned trench through a backside of the second conductive wafer, wherein the first portion and the second portion of the patterned trench each have an annular circumferential opening generally dividing the respective conductive wafer into an inner portion and an outer portion, the inner portion of the respective conductive wafer is insulated from the outer portion of the respective conductive wafer, and the inner portion of the first conductive wafer and the inner portion of the second conductive wafer are electrically connected to serves as a through-wafer conductor. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44, 45)
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46. A through-wafer interconnect which provides electrically conductive interconnection between electric contacts on a front side and a backside of a wafer in a microelectronic structure, the through-wafer interconnect comprising:
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a through-wafer conductor passing through the front side of the wafer to the backside of the wafer; an insulator surrounding at least a main body portion of the conductor; and a frame surrounding the through-wafer conductor and the insulator, wherein at least a portion of the through-wafer conductor and a respective surrounding portion of the frame each comprise a native material of the wafer. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58)
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59. A through-wafer interconnect component comprising:
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a plurality of conductors arranged in an array, each conductor passing through a front side of a conductive wafer to a backside of a wafer; an insulator surrounding each conductor; and a frame supporting the plurality of conductors and the insulator, wherein at least a portion of each conductor and a portion of the frame each comprise a native material of the wafer. - View Dependent Claims (60, 61, 62, 63, 64)
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Specification