3D-COIL FOR SAVING AREA USED BY INDUCTANCES
First Claim
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1. Apparatus comprising:
- a substrate including a first surface;
a planar coil disposed in a metallization above the substrate, wherein the planar coil is disposed perpendicular to the first surface, and wherein the planar coil is coupled to the substrate.
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Abstract
Some embodiments discussed relate to an apparatus, including a planar coil that is disposed in a metallization above and perpendicular to a substrate. Some embodiments include a plurality of planar coils that are disposed in the metallization above and perpendicular to the substrate, and that may be electrically connected, or only inductively coupled. A process includes the formation of the planar coil. A method includes using the planar coil as an inductor that is disposed perpendicular to the substrate. A method includes a plurality of spaced apart planar coils that are used as a transformer apparatus.
41 Citations
27 Claims
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1. Apparatus comprising:
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a substrate including a first surface; a planar coil disposed in a metallization above the substrate, wherein the planar coil is disposed perpendicular to the first surface, and wherein the planar coil is coupled to the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. Apparatus, comprising:
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a substrate, wherein the substrate includes a first surface and plurality of metallization layers disposed thereabove; a planar coil coupled to the first surface, wherein the planar coil is a section of the plurality of metallization layers, and wherein the planar coil is configured perpendicular to the first surface. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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21. A process comprising:
forming a metallization above a first surface of a substrate, wherein forming a metallization includes forming a planar first coil in the metallization that is above and perpendicular to the first surface. - View Dependent Claims (22, 23, 24)
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25. A method comprising:
passing an electrical current through a planar first coil, wherein the planar first coil is disposed above and perpendicular to a first surface of a substrate, and wherein the planar first coil is disposed in a metallization above the first surface. - View Dependent Claims (26, 27)
Specification