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3D-COIL FOR SAVING AREA USED BY INDUCTANCES

  • US 20080204183A1
  • Filed: 02/23/2007
  • Published: 08/28/2008
  • Est. Priority Date: 02/23/2007
  • Status: Abandoned Application
First Claim
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1. Apparatus comprising:

  • a substrate including a first surface;

    a planar coil disposed in a metallization above the substrate, wherein the planar coil is disposed perpendicular to the first surface, and wherein the planar coil is coupled to the substrate.

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