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METHODS FOR ACCURATE IDENTIFICATION OF AN EDGE OF A CARE AREA FOR AN ARRAY AREA FORMED ON A WAFER AND METHODS FOR BINNING DEFECTS DETECTED IN AN ARRAY AREA FORMED ON A WAFER

  • US 20080205745A1
  • Filed: 02/28/2007
  • Published: 08/28/2008
  • Est. Priority Date: 02/28/2007
  • Status: Active Grant
First Claim
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1. A computer-implemented method for identifying an edge of a care area for an array area formed on a wafer, comprising:

  • determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area; and

    identifying the position that is located closest to the inside of the array area and that has the value greater than a threshold as a position of the edge of the care area.

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