Luminescent sheet covering for LEDs

• US 20080206910A1
• Filed: 12/19/2007
• Published: 08/28/2008
• Est. Priority Date: 06/23/2005
• Status: Abandoned Application

• Current Assignee: Chen-Lun Hsing Chen, Emil Radkov, Thomas F. Soules
• Original Assignee: Chen-Lun Hsing Chen, Emil Radkov, Thomas F. Soules
• Inventors: Radkov, Emil, Soules, Thomas F., Chen, Chen-Lun Hsing
• Application Number:
  US12/002,929
• Publication Number:
  US 20080206910A1
• Time in Patent Office: Days
• US Class Current: 438/26
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H05B 33/145 Arrangements of the electroluminescent material
• CPC Class Codes: H05B 33/22 characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Abstract

A lighting apparatus comprising at least one light emitting diode is disposed on an interconnect board to emit ultraviolet or blue radiation. A polymeric layer including a luminophor is disposed about the lighting apparatus to convert at least a portion of the radiation emitted from the LED into visible light. The polymeric layer is shrinkable to conform to a shape enclosing the light emitting diode.

Claims

1. (canceled)

2. (canceled)

4. (canceled)

7. (canceled)

10. (canceled)

11. (canceled)

17. (canceled)

18. (canceled)

19. (canceled)

20. (canceled)

21. (canceled)

22. A method of manufacturing a lighting apparatus, comprising:

liquefying a polymeric material;

stirring phosphor powder into the liquefied polymeric material until the phosphor powder is one of suspended, dipersed or substantially dissolved;

forming a polymeric sheet from the phosphor including polymeric liquid;

positioning at least one light emitting diode on a mounting surface; and

shrink-wrapping the phosphor including polymeric sheet around objects to surround light emitted by the light emitting diode.

3. The method of claim 22, wherein the phosphor is one of:

an inorganic luminescent powder;

an organic luminophor which substantially dissolves in the polymer; and

a nano-particle material.

5. The method of claim 22, wherein a thickness of the polymeric sheet is equal to from about 40 μ

m to about 400 μ

m.

6. The method of claim 22, wherein the polymeric material comprising at least one of:

polyvinyl chloride,

polyethylene, and

polypropylene.

8. The method of claim 22, wherein the polymeric layer is tightly shrink-wrapped over the light emitting to completely cover the light emitting diode and portions of the mounting surface adjacent the light emitting diode.

9. The method of claim 22, wherein the polymeric sheet comprises at least a phosphor which is substantially uniformly distributed over the light emitting diode surface and portions of the interconnect board adjacent the light emitting diode.

12. The method of claim 22, wherein the mounting surface is transparent at least adjacent of the light emitting diode.

13. The method of claim 12, wherein the polymeric layer is shrink-wrapped around the light escaping surface of the board.

14. The method of claim 22, wherein the mounting surface has a high index of refraction and makes optical contact with the light emitting diode chip and the polymeric layer.

15. The method of claim 22, further including:

a heatsink disposed on a side of the mounting surface opposed to the light emitting diode to dissipate heat generated by the light emitting diode.

16. The method of claim 15, wherein the heatsink includes a plurality of wings.