METHODS OF MANUFACTURING A HERMETIC LEAD CONNECTOR

• US 20080208278A1
• Filed: 04/10/2007
• Published: 08/28/2008
• Est. Priority Date: 01/18/2007
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Janzig, Darren A., Paidosh, Chris J., Lindner, Gerald G.
• Granted Patent: US 8,131,370 B2
• Time in Patent Office: Days
• US Class Current: 607/37
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: H01R 43/16 for manufacturing contact members, e.g. by punching and by bending
• CPC Class Codes: H01R 43/20 for assembling or disassembling contact members with insulating base, case or sleeve
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing

Abstract

A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.

Claims

1. A method of manufacturing a hermetic lead connector comprising:

fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly;

fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector, the hermetic lead connector comprising an open end, an outer surface, and an inner surface defining a lead aperture and the hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.

2. A method according to claim 1, wherein the fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring comprises brazing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly.

3. A method according to claim 1, wherein the fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring comprises fixing an electrically insulating ring comprising a single crystal sapphire material between an electrically conducting contact ring comprising titanium and an electrically conducting spacer ring comprising titanium.

4. A method according to claim 2, further comprising disposing a fluid seal material on brazed joints within the hermetic ring subassembly before the fixing of the plurality of the hermetic ring subassemblies in axial alignment.

5. A method according to claim 1, further comprising disposing a helical annular coil within the hermetic ring subassembly before the fixing of the plurality of the hermetic ring subassemblies in axial alignment.

6. A method according to claim 1, wherein the fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector comprises welding a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector.

7. A method according to claim 1, wherein the fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector comprises fixing a first ring subassembly electrically conducting contact ring to an adjacent second ring subassembly electrically conducting spacer ring.

8. A method according to claim 1, wherein fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector comprises fixing a plurality of the hermetic ring subassemblies each having substantially similar dimensions in axial alignment to form a hermetic lead connector comprising an open end, an outer surface, and an inner surface defining a lead aperture having a substantially uniform diameter and the hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.

9. A method according to claim 1, further comprising fixing a mounting flange adjacent to the open end of the hermetic lead connector.

10. A method of manufacturing an implantable active medical device comprising;

providing an active medical device housing defining a housing interior, a power source and electronics in electrical communication are disposed within the housing interior; and

fixing a hermetic lead connector to the active medical device housing, the hermetic lead connector projecting into the housing interior and having an open end projecting through the active medical device housing, the hermetic lead connector comprising an outer surface and an inner surface defining a lead aperture, the hermetic lead connector comprising one or more electrically conducting contact rings spaced apart by electrically insulating rings, the one or more electrically conducting contact rings in electrical communication with the electronics, and the hermetic lead connector providing a hermetic seal between the hermetic lead connector outer surface and the hermetic lead connector inner surface.

11. A method according to claim 10, further comprising hermetically sealing the hermetic lead connector within the housing interior to form a hermetically sealed active device housing.

12. A method according to claim 10, further comprising fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector.

13. A method according to claim 12, wherein the fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring comprises brazing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly.

14. A method according to claim 13, further comprising disposing a fluid seal material on brazed joints within the hermetic ring subassembly before the fixing a plurality of the hermetic ring subassemblies in axial alignment.

15. A method according to claim 12, further comprising disposing a helical annular coil within the hermetic ring subassembly before the fixing of the plurality of the hermetic ring subassemblies in axial alignment.

16. A method according to claim 12, wherein the fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector comprises fixing a first ring subassembly electrically conducting contact ring to an adjacent second ring subassembly electrically conducting spacer ring.

17. A method according to claim 12, wherein fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector comprises fixing a plurality of the hermetic ring subassemblies each having substantially similar dimensions in axial alignment to form a hermetic lead connector comprising an open end, an outer surface, and an inner surface defining a lead aperture having a substantially uniform diameter and the hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.

18. A method according to claim 12, wherein the fixing a hermetic lead connector to the active medical device housing step further comprises fixing a mounting flange adjacent to the open end of the hermetic lead connector and then fixing the mounting flange to the active medical device housing.

19. A method of manufacturing an implantable active medical device comprising;

disposing a hermetic lead connector into an active medical device housing, the active medical device housing defining a housing interior, a power source and electronics in electrical communication are disposed within the housing interior, the hermetic lead connector having an open end projecting through the active medical device housing, the hermetic lead connector defining a hermetic lead connector outer surface and a hermetic lead connector inner surface defining a lead aperture, the hermetic lead connector comprising one or more electrically conducting contact rings spaced apart by electrically insulating rings, the one or more electrically conducting contact rings in electrical communication with the electronics, and the lead connector providing a hermetic seal between the lead connector outer surface and the lead connector inner surface.