FAILURE ANALYSIS SYSTEM AND METHOD USING THE SAME

• US 20080210015A1
• Filed: 09/27/2007
• Published: 09/04/2008
• Est. Priority Date: 02/02/2007
• Status: Active Grant

• Current Assignee: FIH (Hong Kong) Limited (Hon Hai Precision Industry Co., Ltd.), Shenzhen Futaihong Precision Industrial Company Limited (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Shenzhen Futaihong Precision Industrial Company Limited (Hon Hai Precision Industry Co., Ltd.), Sutech Trading Limited
• Inventors: DONG, LIN-SEN, CHEN, PING, LI, LEI, CHENG, ZHI, TAO, YONG-ZHI, LI, DONG, LI, HU
• Granted Patent: US 7,543,507 B2
• Time in Patent Office: Days
• US Class Current: 73/851
• CPC Class Codes: G01B 3/18 Micrometers
• CPC Class Codes: G01N 2203/0067 Fracture or rupture
• CPC Class Codes: G01N 2203/0641 using optical, X-ray, ultraviolet, infrared or similar detectors
• CPC Class Codes: G01N 3/20 by applying steady bending forces G01N3/26, G01N3/28 take precedence
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion

Abstract

A failure analysis system (900) for printed circuit board (600) includes testing equipment (100) and a monitor (200). The testing equipment includes a base (120), a fixing body (180), a supporting arm (140) and a micrometer (160). The fixing body and the supporting arm are both firmly fixed on the base. The printed circuit board is fastened to the fixing body. The micrometer is slidingly attached to the supporting arm. The micrometer has a pin (1612) at one end thereof for resisting one end of the printed circuit board. The monitor electronically connects with the printed board for receiving signals from the printed circuit board. When the pin of the micrometer reaches a certain position, the signal transmitted to the monitor is broken.

Claims

1. A failure analysis system for a printed circuit board, comprising:

a testing equipment including;

a base;

a fixing body for fastening a printed circuit board thereon;

a supporting arm being fixed on the base; and

a micrometer being slidingly attached to the supporting arm, the micrometer including a pin at one end thereof, the pin being operative to be moved in a vertical direction for resisting one end of the printed circuit board; and

a monitor being electronically connecting with the printed board for detecting signals sent from the printed circuit board when the printed circuit board has not been bent to fail;

wherein when the pin of the micrometer is operated to resist and force the printed circuit board to bend beyond a predetermined angle and fail, the monitor detects no signals sent from the printed circuit board.

2. The failure analysis system as claimed in claim 1, further comprising a sliding member, wherein the sliding member defines a sliding slot, the sliding slot is configured for receiving the supporting arm, and the micrometer is fixed in the sliding member.

3. The failure analysis system as claimed in claim 2, wherein the supporting arm comprises a horizontal portion and a vertical portion, the vertical portion being attached to the base, and the sliding member being slidingly attached to the horizontal portion.

4. The failure analysis system as claimed in claim 3, wherein the supporting arm is L-shaped, and the horizontal portion is oriented perpendicular to the vertical portion.

5. The failure analysis system as claimed in claim 3, wherein the sliding member comprises a sliding portion and a fixing portion, the sliding slot is positioned in the sliding portion, and the fixing portion has a receiving hole for receiving the micrometer.

6. The failure analysis system as claimed in claim 2, wherein the micrometer is attached to the sliding member by screws.

7. The failure analysis system as claimed in claim 1, wherein the printed circuit board is attached to the fixing body by a screw.

8. The failure analysis system as claimed in claim 7, wherein the fixing body comprises a column and a positioning post, and the printed circuit board is fastened to the positioning post.

9. The failure analysis system as claimed in claim 1, further comprising a camera and an output element, wherein the camera and the output element are mounted on the printed circuit board, the camera electronically connects with the output element, and the monitor electronically connects with the output element.

10. The failure analysis system as claimed in claim 1, wherein the monitor can be selected from the group consisting of a computer, an oscillograph and an oscilloscope.

11. A method for analyzing failure of a printed circuit board, comprising steps of:

fixing an end of the printed circuit board to a fixing body, leaving other portions of the printed circuit suspended;

electronically connecting the printed circuit board to a monitor which supplies power to the printed circuit board thus enabling the printed circuit board to continuously send signals and the signals are detected by the monitor;

moving a pin of a micrometer to touch a second end of the printed circuit board and recording a first value of the micrometer once the pin has just touched the printed circuit board;

keeping moving the pin of the micrometer to further touch the printed circuit board and bend the printed circuit board until the monitor detects no signals sent from the printed circuit board, simultaneously recording a second value of the micrometer;

counting the distance of the pin moved according to the recorded first value and second value of the micrometer thereby determining a critical curve angle of the printed circuit board.