CHIP MODULE AND METHOD FOR PRODUCING A CHIP MODULE

• US 20080211087A1
• Filed: 12/19/2007
• Published: 09/04/2008
• Est. Priority Date: 12/20/2006
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: MUELLER-HIPPER, ANDREAS, PUESCHNER, FRANK
• Granted Patent: US 7,714,454 B2
• Time in Patent Office: Days
• US Class Current: 257/704
• CPC Class Codes: G06K 19/07724 the record carrier being at least partially made by a molding process molding in general B29C45/14
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A chip module comprises a substrate, a chip arranged on one side of the substrate and conductor structures arranged on at least one side of the substrate and conductively connected to the chip. At least one stiffening element is arranged on one side of the substrate and a moulding cap encapsulates at least the chip. For producing the chip module, provision is made for providing a substrate and applying conductor structures to at least one side of the substrate. At least one stiffening element is mounted onto one side of the substrate. Furthermore, a chip is mounted onto one side of the substrate and connected to the conductor structures. A moulding compound is applied on the substrate, such that the chip is covered.

Claims

1. A chip module comprising:

a substrate;

a chip arranged on one side of the substrate;

conductor structures arranged on at least one side of the substrate, conductively connected to the chip;

at least one stiffening element arranged on one side of the substrate; and

a moulding cap, configured to encapsulate at least the chip.

2. The chip module according to claim 1, wherein the substrate is flexible.

3. The chip module according to claim 1, wherein the moulding cap encapsulates the stiffening element or one of the stiffening elements.

4. The chip module according to claim 1, wherein regions that are free of moulding material are provided between the moulding cap and the stiffening element or one of the stiffening elements.

5. The chip module according to claim 1, wherein the stiffening element or one of the stiffening elements is arranged between one side of the substrate and the chip.

6. The chip module according to claim 1, wherein the stiffening element or one of the stiffening elements has a cavity in which the chip is positioned.

7. The chip module according to claim 1, wherein the stiffening element or one of the stiffening elements is arranged alongside the chip or around the chip.

8. The chip module according to claim 7, wherein the stiffening element or one of the stiffening elements is formed in frame-type fashion.

9. The chip module according to claim 1, wherein portions of the conductor structures are arranged between the stiffening element or one of the stiffening elements and the substrate.

10. A chip module comprising:

a flexible substrate;

a chip arranged on one side of the substrate;

conductor structures arranged on at least one side of the substrate and conductively connected to the chip;

at least one stiffening element arranged on one side of the substrate, wherein the stiffening element is configured to be arranged alongside or around the chip; and

a moulding cap, configured to encapsulate at least the chip.

11. The chip module according to claim 10, wherein the stiffening element is formed in frame-type fashion.

12. The chip module according to claim 10, wherein the moulding cap encapsulates the at least one stiffening element.

13. The chip module according to claim 10, wherein regions that are free of moulding material are provided between the moulding cap and the at least one stiffening element.

14. The chip module according to claim 10, wherein a first distance between a side of the stiffening element or one of the stiffening elements that is remote from the substrate and a side of the substrate is greater than a second distance between a side of the moulding cap that is remote from the substrate and the same side of the substrate.

15. The chip module according to claim 10, wherein a first distance between a side of the stiffening element or one of the stiffening elements that is remote from the substrate and a side of the substrate is less than a second distance between a side of the moulding cap that is remote from the substrate and the same side of the substrate.

16. The chip module according to claim 10, wherein the chip module comprises a contactless interface or contacts for connection of a contactless interface.

17. A method for producing a chip module comprising:

providing a substrate;

applying conductor structures to at least one side of the substrate;

mounting at least one stiffening element onto one side of the substrate;

mounting a chip onto one side of the substrate;

connecting the chip to the conductor structures; and

applying a moulding compound on the substrate, such that the chip is covered.

18. The method according to claim 17, wherein the moulding compound is applied such that the stiffening element or one of the stiffening elements is covered.

19. The method according to claim 17, wherein the moulding compound is applied such that regions of the stiffening element or of one of the stiffening elements that face the chip remain free of moulding material.

20. The method according to claim 17, wherein the chip is mounted onto the stiffening element or one of the stiffening elements.

21. The method according to claim 17, wherein the stiffening element or one of the stiffening elements is applied in a region on one side of the substrate that is free of conductor structures.

22. The method according to claim 17, wherein the stiffening element or one of the stiffening elements is applied on the conductor structures.

23. The method according to claim 17, wherein the stiffening element or one of the stiffening elements is arranged around the chip.

24. A chip module comprising:

a substrate;

a chip arranged on one side of the substrate;

at least one stiffening element arranged on a same side of the substrate as the chip, wherein the stiffening element is designed of one-piece construction, and comprises a cavity in which the chip is positioned;

conductor structures configured to be conductively connected to the chip on at least the same side of the substrate as the chip; and

a mould cap configured to encapsulate at least the chip.

25. A method for producing a chip module comprising:

providing a substrate;

applying conductor structures to at least one side of the substrate;

mounting at least one stiffening element onto one side of the substrate;

etching a cavity into the stiffening element;

mounting a chip onto one side of the substrate;

connecting the chip to the conductor structures; and

applying a moulding compound on the substrate such that the chip is covered.