×

Power Semiconductor Module and Method for Producing the Same

  • US 20080211091A1
  • Filed: 03/21/2008
  • Published: 09/04/2008
  • Est. Priority Date: 09/21/2005
  • Status: Active Grant
First Claim
Patent Images

1. A method for producing a power semiconductor module, the method comprising:

  • joining contact regions of a power semiconductor circuit of the power semiconductor module with the contact ends of a contact element of the power semiconductor module via ultrasonic welding by a sonotrode; and

    forming contacts via ultrasonic welding by the sonotrode, consequently joining the contacts and foot regions.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×