Power Semiconductor Module and Method for Producing the Same
First Claim
Patent Images
1. A method for producing a power semiconductor module, the method comprising:
- joining contact regions of a power semiconductor circuit of the power semiconductor module with the contact ends of a contact element of the power semiconductor module via ultrasonic welding by a sonotrode; and
forming contacts via ultrasonic welding by the sonotrode, consequently joining the contacts and foot regions.
2 Assignments
0 Petitions
Accused Products
Abstract
A method for producing a power semiconductor module including forming a contact between a contact region and a contact element as an ultrasonic welding contact via a sonotrode. The ultrasonic welding operation also being used for joining the contact regions with the contact ends and consequently for joining the contacts and the foot regions.
-
Citations
31 Claims
-
1. A method for producing a power semiconductor module, the method comprising:
-
joining contact regions of a power semiconductor circuit of the power semiconductor module with the contact ends of a contact element of the power semiconductor module via ultrasonic welding by a sonotrode; and forming contacts via ultrasonic welding by the sonotrode, consequently joining the contacts and foot regions.
-
-
2. A method for producing a power semiconductor module, the method comprising:
-
mechanically and electrically connecting a first contact end of a contact element of the power semiconductor module to a first contact region of a power semiconductor circuit of the power semiconductor module via ultrasonic welding, thereby forming a first contact; and joining a further contact end of the contact element with a further contact region of the semiconductor circuit via ultrasonic welding, thereby forming a further contact electrically and mechanically connected to the first contact; wherein the contact element is a current tap made of solid copper or substantially copper-containing alloy with a material thickness between approximately 0.1 mm and approximately 3.0 mm and a current-carrying capacity between approximately 50 A and approximately 2000 A; wherein at least one of the contact regions is formed by a copper or substantially copper-containing layer of a direct copper bonding DCB substrate, the layer having a material thickness between approximately 0.1 mm and approximately 1.0 mm; wherein the ultrasonic welding is performed via a sonotrode with an ultrasonic welding power between approximately 300 W and 10 kW and a joining force between approximately 500 N and 3500 N. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
-
-
26. A power semiconductor module, comprising:
-
a power semiconductor circuit with contact regions; and a contact element with contact ends joined to respective ones of the contact regions via ultrasonic welded contacts.
-
-
27. A power semiconductor module, comprising:
-
a power semiconductor circuit with contact regions; a contact element with contact ends mechanically and electrically connected to respective ones of the contact regions via ultrasonically welded contacts; and a direct copper bonding DCB substrate including a copper or substantially copper-containing layer having a material thickness between approximately 0.1 mm and approximately 1.0 mm; wherein the contact element is a current tap made of solid copper or substantially copper-containing alloy with a material thickness between approximately 0.1 mm and approximately 3.0 mm and a current-carrying capacity between approximately 50 A and approximately 2000 A; wherein at least one of the contact regions is part of the copper or substantially copper-containing layer. - View Dependent Claims (28, 29, 30, 31)
-
Specification