Method of assembling chips
3 Assignments
0 Petitions
Accused Products
Abstract
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
81 Citations
40 Claims
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1-20. -20. (canceled)
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21. A chip package comprising:
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a first substrate; a chip over said first substrate; a copper pillar between said chip and said first substrate, wherein said copper pillar has a thickness greater than a vertical distance between said copper pillar and said first substrate; and a tin-containing layer between said copper pillar and said first substrate and on a sidewall of said copper pillar. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28)
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29. A chip package comprising:
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a first substrate; a chip over said first substrate; a copper pillar between said chip and said first substrate, wherein said copper pillar has a thickness greater than a vertical distance between said copper pillar and said first substrate; a tin-and-gold-containing layer between said copper pillar and said first substrate, wherein said thickness of said copper pillar is greater than that of said tin-and-gold-containing layer; and a tin-containing layer on a sidewall of said copper pillar. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36)
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37. A chip package comprising:
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a substrate; a chip over said substrate; a copper pillar between said chip and said substrate, wherein said copper pillar has a thickness greater than a vertical distance between said copper pillar and said substrate; and a tin-containing layer between said chip and said substrate, wherein said tin-containing layer covers a bottom surface of said copper pillar and a sidewall of said copper pillar. - View Dependent Claims (38, 39, 40)
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Specification