Method of coating semiconductor processing apparatus with protective yttrium-containing coatings
First Claim
1. A method of spray-coating a surface of an article to provide erosion resistance to a halogen-containing plasma, wherein said coating is sprayed using a technique selected from the group consisting of flame spraying, thermal spraying and plasma spraying, and wherein said coating comprises at least one yttrium-containing solid solution.
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Abstract
Methods of applying specialty ceramic materials to semiconductor processing apparatus, where the specialty ceramic materials are resistant to halogen-comprising plasmas. The specialty ceramic materials contain at least one yttrium oxide-comprising solid solution. Some embodiments of the specialty ceramic materials have been modified to provide a resistivity which reduces the possibility of arcing within a semiconductor processing chamber.
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Citations
30 Claims
- 1. A method of spray-coating a surface of an article to provide erosion resistance to a halogen-containing plasma, wherein said coating is sprayed using a technique selected from the group consisting of flame spraying, thermal spraying and plasma spraying, and wherein said coating comprises at least one yttrium-containing solid solution.
- 16. A of applying a coating a surface of an article to provide erosion resistance to a halogen-containing plasma, wherein said coating is sputter deposited from a target which comprises at least one yttrium-containing solid solution.
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