METHODS OF FABRICATING A LARGE AREA TRANSDUCER ARRAY
First Claim
1. A method for fabricating a tiled transducer array, the method comprising:
- fabricating a wafer comprising a plurality of transducers;
dicing the wafer to form individual transducers;
testing the individual transducers to identify a plurality of known good transducers;
preparing a substrate having a front side and a backside, wherein the backside of the substrate comprises a plurality of connectors;
positioning the plurality of known good transducers on the front side of the substrate and aligning the plurality of transducers in a horizontal direction and a vertical direction to form a transducer array; and
electrically coupling the connectors on the substrate to the plurality of known good transducers, wherein the connectors are arranged such that each of the plurality of known good transducers may be electrically coupled to an electronic device disposed on the backside of the substrate, through a respective one or more of the plurality of connectors.
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Accused Products
Abstract
Methods of fabricating a tiled transducer array are disclosed. Embodiments of the methods include fabricating a wafer comprising a plurality of transducers, dicing the wafer to form individual transducers, testing the individual transducers to identify a plurality of known good transducers, preparing a substrate having a front side and a backside wherein the backside of the substrate comprises a plurality of connectors, positioning the plurality of known good transducers on the front side of the substrate and aligning the plurality of transducers in a horizontal direction and a vertical direction to form a transducer array, and electrically coupling the connectors on the substrate to the plurality of known good transducers, wherein the connectors are arranged such that each of the plurality of known good transducers may be electrically coupled to an electronic device disposed on the backside of the substrate, through a respective one or more of the plurality of connectors.
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Citations
20 Claims
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1. A method for fabricating a tiled transducer array, the method comprising:
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fabricating a wafer comprising a plurality of transducers; dicing the wafer to form individual transducers; testing the individual transducers to identify a plurality of known good transducers; preparing a substrate having a front side and a backside, wherein the backside of the substrate comprises a plurality of connectors; positioning the plurality of known good transducers on the front side of the substrate and aligning the plurality of transducers in a horizontal direction and a vertical direction to form a transducer array; and electrically coupling the connectors on the substrate to the plurality of known good transducers, wherein the connectors are arranged such that each of the plurality of known good transducers may be electrically coupled to an electronic device disposed on the backside of the substrate, through a respective one or more of the plurality of connectors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for fabricating a stacked three-dimensional transducer array, the method comprising:
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obtaining a substrate having a front side, a backside, and an electrical interconnect; disposing a plurality of transducers on the front side of the substrate; and coupling the plurality of transducers on the front side of the substrate to an associated electronic device. - View Dependent Claims (12, 13)
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14. A method of aligning a plurality of electronic devices with a plurality of transducers in a transducer array disposed generally in an X-Y plane, the method comprising:
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positioning each of a plurality of electronic devices in a direction; aligning the each of the plurality of transducers with at least one of the plurality of electronic devices via a pre-fabricated spacer; and coupling each of the plurality of electronic devices to the transducer array via an interconnect. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification