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METHODS FOR FABRICATING SEMICONDUCTOR COMPONENTS AND PACKAGED SEMICONDUCTOR COMPONENTS

  • US 20080213976A1
  • Filed: 03/02/2007
  • Published: 09/04/2008
  • Est. Priority Date: 03/02/2007
  • Status: Active Grant
First Claim
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1. A method of manufacturing semiconductor components, comprising:

  • forming a plurality of first trenches in lanes between dies on a first side of a semiconductor wafer;

    filling at least a portion of the first trenches with a protective material;

    forming a plurality of second trenches on a second side of the wafer, wherein the first trenches are at least generally aligned with the second trenches along the lanes;

    filling at least a portion of the second trenches with the protective material; and

    cutting through the wafer along the lanes.

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