METHOD OF FABRICATING SEMICONDUCTOR WAFER
First Claim
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1. A method of fabricating a wafer comprising:
- preparing a substrate wafer having a non-single-crystalline thin layer;
disposing at least one single crystalline pattern adjacent to the non-single-crystalline thin layer on the substrate wafer; and
forming a material layer contacting the single crystalline pattern on the non-single-crystalline thin layer.
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Abstract
Provided is a method of fabricating a semiconductor wafer. The method includes preparing a substrate wafer having a non-single-crystalline thin layer; disposing at least one single crystalline pattern adjacent to the non-single-crystalline thin layer on the substrate wafer; and forming a material layer contacting the single crystalline pattern on the non-single-crystalline thin layer.
205 Citations
36 Claims
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1. A method of fabricating a wafer comprising:
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preparing a substrate wafer having a non-single-crystalline thin layer; disposing at least one single crystalline pattern adjacent to the non-single-crystalline thin layer on the substrate wafer; and forming a material layer contacting the single crystalline pattern on the non-single-crystalline thin layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of fabricating a wafer comprising:
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preparing a first wafer having at least one single crystalline pattern; preparing a second wafer having a non-single-crystalline thin layer; disposing the first wafer on the second wafer such that a top surface of the single crystalline pattern is disposed adjacent to a top surface of the non-single-crystalline thin layer; forming a material layer contacting at least a portion of the single crystalline pattern on the non-single-crystalline thin layer; and separating the first wafer from the second wafer to leave a portion of the single crystalline pattern on the second wafer. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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Specification