Reworkable thermosetting resin composition

• US 20080214840A1
• Filed: 12/20/2007
• Published: 09/04/2008
• Est. Priority Date: 03/31/2000
• Status: Active Grant

• Current Assignee: Henkel IP & Holding GmbH (Henkel AG & Co KGaA)
• Original Assignee: Henkel Corporation (Henkel AG & Co KGaA)
• Inventors: Doba, Takahisa, Messana, Andrew D., Torres-Filho, Afranio, Klemarczyk, Philip T., Yaeger, Erin K.
• Granted Patent: US 8,053,587 B2
• Time in Patent Office: Days
• US Class Current: 549/90
• CPC Class Codes: C07D 407/12 linked by a chain containing hetero atoms as chain links
• CPC Class Codes: C07D 493/08 Bridged systems
• CPC Class Codes: C07D 493/10 Spiro-condensed systems
• CPC Class Codes: C08G 59/24 carbocyclic
• CPC Class Codes: C08G 59/40 characterised by the curing agents used
• CPC Class Codes: C08K 5/0025 Crosslinking or vulcanising agents; including accelerators
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]

Abstract

This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Claims

1-32. -32. (canceled)

33. A compound within the following structure:

34. A compound within the structure:

35. A compound within the structure:

36. A compound represented by:

37. A compound represented by:

38. A compound selected from the group consisting of:

39. A compound represented by: