Producing method of solid state pickup device, and attaching method and device for the same

• US 20080216311A1
• Filed: 04/23/2008
• Published: 09/11/2008
• Est. Priority Date: 04/24/2002
• Status: Abandoned Application

• Current Assignee: Akihisa Yamazaki, Atsushi Misawa, Takeshi Misawa
• Original Assignee: Akihisa Yamazaki, Atsushi Misawa, Takeshi Misawa
• Inventors: Misawa, Atsushi, Misawa, Takeshi, Yamazaki, Akihisa
• Application Number:
  US12/081,899
• Publication Number:
  US 20080216311A1
• Time in Patent Office: Days
• US Class Current: 29/760
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49007 Indicating transducer
• CPC Class Codes: Y10T 29/4908 Acoustic transducer
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49798 Dividing sequentially from leading end, e.g., by cutting or breaking
• CPC Class Codes: Y10T 29/49826 Assembling or joining
• CPC Class Codes: Y10T 29/49904 Assembling a subassembly, then assembling with a second subassembly
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53265 with work-holder for assembly

Abstract

A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.

Claims

1. A solid state pickup device, comprising:

an imaging element on a wafer, the imaging element including a light receiving surface and a plurality of contact points; and

a shield glass with a receiving surface border portion protruding therefrom, wherein said receiving surface border portion and said shield glass are formed from a same glass plate,

wherein said wafer is attached to said receiving surface border portion of said shield glass such that said light receiving surface of said wafer is surrounded by said receiving surface border portion.

2. The device as defined in claim 1, wherein said light receiving surface has substantially a quadrilateral shape, and said receiving surface border portions protrude substantially in a quadrilateral shape in a position about said light receiving surface.

3. The device as defined in claim 2, wherein said plurality of contact points are disposed outside said light receiving surface and outside a covered area of said shield glass.

4. The device as defined in claim 1, wherein a space exists between said light receiving surface of said wafer and an inner surface of said shield glass.

5. The device as defined in claim 1, wherein a surface area of said shield glass is not aligned with a surface area of said wafer.

6. The device as defined in claim 1, wherein said receiving surface border portions of said shield glass is attached to said wafer on a portion of a surface of said wafer between said light receiving surface and said plurality of contact points.