WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

• US 20080217052A1
• Filed: 03/06/2008
• Published: 09/11/2008
• Est. Priority Date: 03/07/2007
• Status: Abandoned Application

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: MATSUI, Akiko
• Application Number:
  US12/043,432
• Publication Number:
  US 20080217052A1
• Time in Patent Office: Days
• US Class Current: 174/266
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/09627 Special connections between adjacent vias, not for grounding vias
• CPC Class Codes: H05K 2203/0207 Partly drilling through substrate until a controlled depth, e.g. with end-point detection
• CPC Class Codes: H05K 2203/0242 Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
• CPC Class Codes: H05K 2203/162 Testing a finished product, e.g. heat cycle testing of solder joints
• CPC Class Codes: H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
• CPC Class Codes: H05K 3/0047 Drilling of holes
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A wiring board including a plated through hole formed in the wiring board; a test plated through hole or a test via hole provided in the surrounding area of the plated through hole to check a processing state related to the plated through hole; and a conductive pattern used to electrically connect the plated through hole to the test through hole or the test via hole.

Claims

1. A wiring board, comprising:

a plated through hole formed in the wiring board;

a test plated through hole or a test via hole provided in the surrounding area of the plated through hole to check a processing state related to the plated through hole; and

a conductive pattern used to electrically connect the plated through hole to the test through hole or the test via hole.

2. A wiring board, comprising:

a plated through hole formed in the wiring board;

a processing hole formed to remove a part of the plated through hole in the position where the plated through hole is provided;

a test plated through hole and a test via hole in the surrounding area of the test plated through hole to check a processing state related to the plated through hole; and

a conductive pattern extended between the processing hole where the plated through hole is removed and the test plated through hole or the via hole, and also is electrically connected to the test plated through hole or the test via hole.

3. The wiring board according to claim 2, wherein the processing hole is deeper than the distance from the surface of the processing hole to the conductive pattern.

4. The wiring board according to claim 2, wherein the conductive pattern includes a plurality of wiring patterns extended from a plurality of positions around the processing hole, and the test plated through hole or the test via hole is provided for each of the wiring patterns.

5. The wiring board according to claim 4, wherein four of the wiring patterns are provided equiangularly around the processing hole.

6. The wiring board according to claim 2, wherein the conductive pattern includes a plurality of wiring patterns extended from a plurality of positions around the processing hole, and a plurality of the wiring patterns are connected to the test plated through hole or the via hole.

7. The wiring board according to claim 6, wherein the conductive pattern further includes a relay wiring pattern connected by all of the wiring patterns, and the relay wiring pattern is connected to the test plated through hole or the test via hole.

8. The wiring board according to claim 7, wherein the relay wiring pattern has an annulus ring shape surrounding the processing hole.

9. The wiring board according to claim 2, wherein the conductive pattern includes a conductive layer formed in the board, and the conductive layer is formed in an area including the processing hole and the test plated through hole or the test via hole.

10. The wiring board according to claim 9, wherein the conductive layer is a ground layer considered to be at ground potential.

11. The wiring board according to claim 9, wherein the conductive layer is separated from the plated through hole in which the processing hole is not formed.

12. A method of manufacturing a wiring board, comprising:

forming a plated through hole in the wiring board;

forming a test plated through hole or a via hole in the wiring board;

forming a conductive pattern which is used to electrically connect the plated through hole to the test plated through hole or the test via hole; and

forming a processing hole in a position in the wiring board where the plated through hole is located.

13. The method of manufacturing the wiring board according to claim 12, wherein the forming the processing hole comprises

removing a part of the conductive pattern with a part of the plated through hole so that the plated through hole is electrically separated from the test plated through hole or the test via hole.

14. The method of manufacturing the wiring board according to claim 12, further comprising:

testing an electrical continuity between the plated through hole and the test plated through hole after the processing hole is formed; and

determining a quality of processing state of the processing hole based on the test result.

15. The method of manufacturing the wiring board according to claim 14, wherein the determining the quality of processing state of the processing hole comprises determining the quality of processing state to be good when there is no electrical continuity between the plated through hole and the test plated through hole or the test via hole after the processing hole is formed.