MEMS PACKAGE HAVING AT LEAST ONE PORT AND MANUFACTURING METHOD THEREOF

• US 20080217709A1
• Filed: 02/21/2008
• Published: 09/11/2008
• Est. Priority Date: 03/07/2007
• Status: Abandoned Application

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Minervini, Anthony, Massingill, Gwendolyn P.
• Application Number:
  US12/034,764
• Publication Number:
  US 20080217709A1
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81C 1/00873 characterised by special arrangements of the devices, allowing an easier separation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides

Abstract

A plurality of individual MEMS packages are formed as a contiguous unit and each of the plurality of individual MEMS packages include at least one acoustic port. One or more separation boundaries from where to separate adjacent ones of the plurality of individual MEMS packages are determined. Each of the plurality of individual MEMS packages are subsequently separated from the others according to the one or more separation boundaries to provide separate and distinct individual MEMS packages. Each acoustic port disposed within each separate and distinct individual MEMS package is exposed due to the separating so as to allow sound energy to enter each separate and distinct individual MEMS package.

Claims

1. A method of forming a plurality of separate and distinct individual micro-electromechanical system (MEMS) packages comprising:

forming a plurality of individual MEMS packages as a contiguous unit, each of the plurality of individual MEMS packages including at least one acoustic port;

determining one or more separation boundaries from where to separate adjacent ones of the plurality of individual MEMS packages; and

subsequently separating each of the plurality of individual MEMS packages from the others according to the one or more separation boundaries to provide separate and distinct individual MEMS packages, wherein each acoustic port disposed within each separate and distinct individual MEMS package is exposed because of the separating so as to allow sound energy to enter each separate and distinct individual MEMS package.

2. The method of claim 1 further comprising mounting the contiguous unit on a mounting tape.

3. The method of claim 1 wherein separating comprises separating utilizing a process selected from a group consisting of sawing, laser cutting, scribing, and breaking.

4. The method of claim 1 further comprising at least partially applying a protective coating to each of the plurality of individual MEMS packages and subsequent to the separating, curing each of the separate and distinct individual MEMS packages to remove the coating.

5. The method of claim 1 wherein forming a plurality of individual MEMS packages comprises forming a base and a first structure attached to the base.

6. The method of claim 5 wherein each of the plurality of individual MEMS packages includes a cavity and wherein forming a plurality of individual MEMS packages comprises further disposing an electronic device and a MEMS die within the cavity of each of the plurality of individual MEMS packages and wherein the MEMS package is a package selected from a group consisting of a single MEMS package and a dual MEMS package.

7. A method of forming a micro-electromechanical system (MEMS) package comprising:

forming a MEMS package, the MEMS package including an elongated base;

disposing at least one MEMS device onto the base;

folding a first portion of the base to at least partially surround the at least one MEMS device and to form at least one acoustic port that allows sound energy to be received at the at least one MEMS device.

8. The method of claim 7 wherein folding a first portion of the base comprises folding the first portion of the base so as to provide a side wall adjacent to the MEMS device.

9. The method of claim 7 wherein folding a first portion of the base comprises folding the first portion of the base so as to provide a cover for the MEMS device.

10. The method of claim 7 wherein folding a first portion of the base comprises folding the first portion of the base so as to be at least partially under a remaining portion of the base.

11. The method of claim 7 wherein the MEMS device comprises a MEMS die and an electronic device.

12. The method of claim 11 wherein the electronic device comprises an integrated circuit and wherein the MEMS die comprises a microphone.

13. A micro-electromechanical system (MEMS) package comprising:

a first structure;

a second structure disposed on the first structure and forming a first cavity, the second structure having at least one side wall attached to the first structure;

at least one MEMS die disposed in the cavity;

a first acoustic port formed through the sidewall, the first acoustic port providing a passageway to allow sound energy to enter the MEMS package and be received at the at least one MEMS die.

14. The MEMS package of claim 13 further comprising an electronic device disposed in the cavity.

15. The MEMS package of claim 14 wherein the electronic device comprises one of an integrated circuit, a capacitor, a resistor, and an inductor.

16. The MEMS package of claim 13 wherein the MEMS die comprises one of a microphone, a speaker, a receiver, and a conjoined microphone and receiver.

17. The MEMS package of claim 13 wherein the MEMS package is disposed within a cavity of an electronic apparatus, and the electronic apparatus includes a second acoustic port for providing a second passageway to allow sound energy to be received in the second cavity of the electronic apparatus from outside the portable electronic apparatus.

18. The MEMS package of claim 17 wherein the electronic apparatus comprises one of a cellular phone, a laptop, a tablet computer, a personal digital assistant, a camera, a listening device, and a hearing aid.

19. The MEMS package of claim 17 wherein the second cavity includes one of a back volume and a front volume.

20. A micro-electromechanical system (MEMS) package comprising:

a MEMS structure, the MEMS structure including an elongated base;

at least one MEMS device disposed onto the elongated base; and

a first folded portion of the elongated base being configured in folded relation to a remaining portion of the elongated base and at least partially surrounding the at least one

MEMS device, the first folded portion at least partially forming at least one acoustic port to allow sound energy to be received at the MEMS device.

21. The MEMS package of claim 20 wherein the first folded portion provides a side wall for the MEMS package.

22. The MEMS package of claim 20 wherein the first folded portion provides a cover for the MEMS package.

23. The MEMS package of claim 20 wherein the first folded portion is at least partially folded under the remaining portion of the base.