Piezoelectric package with enlarged conductive layers

• US 20080218026A1
• Filed: 02/27/2008
• Published: 09/11/2008
• Est. Priority Date: 02/27/2007
• Status: Abandoned Application

• Current Assignee: Iptrade Limited
• Original Assignee: Iptrade Limited
• Inventors: Kessenich, Grace R., Pletner, Baruch
• Application Number:
  US12/038,782
• Publication Number:
  US 20080218026A1
• Time in Patent Office: Days
• US Class Current: 310/314
• CPC Class Codes: F16F 2224/0283 piezoelectric; electro- or magnetostrictive
• CPC Class Codes: H10N 30/00 Piezoelectric or electrostrictive devices integrated devices or assemblies of multiple devices H10N39/00
• CPC Class Codes: H10N 30/02 Forming enclosures or casings
• CPC Class Codes: H10N 30/88 Mounts; Supports; Enclosures; Casings
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A piezoelectric package comprises a piezoelectric plate having a first planar surface and a second planar surface that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer electrically coupled to the first planar surface, and a second electrically conductive layer electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (e.g., a rigid fiber composite material) encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.

Claims

1. A piezoelectric package, comprising:

a piezoelectric plate having first planar surface and a second planar surface that are electrically isolated from each other;

a first electrically conductive layer electrically coupled to the first planar surface, wherein a ratio of an area of the first electrically conductive layer to the area of the first planar surface is equal to or greater than unity;

a second electrically conductive layer electrically coupled to the second planar surface; and

a first electrically insulative material encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.

2. The piezoelectric package of claim 1, wherein a ratio of an area of the second electrically conductive layer to the area of the second planar surface is equal to or greater than unity.

3. The piezoelectric package of claim 1, wherein the first and second electrically conductive layers are composed of a porous material, and wherein a portion of the first electrically insulative material is embedded within the porous material.

4. The piezoelectric package of claim 3, wherein the porous material is mesh.

5. The piezoelectric package of claim 1, wherein the first electrically insulative material is composed of a rigid fiber composite material.

6. The piezoelectric package of claim 1, further comprising a second electrically insulative material disposed between the first and second electrically conductive layers.

7. The piezoelectric package of claim 6, wherein the second electrically insulative material is disposed over peripheral regions of the first planar surface and the second planar surface, the piezoelectric package further comprising:

a first vertical conductor electrically coupled between a center region of the first planar surface and the first electrically conductive layer; and

a second vertical conductor electrically coupled between a center region of the second planar surface and the second electrically conductive layer.

8. The piezoelectric package of claim 1, further comprising:

a first surface electrode covering the first planar surface, wherein the first electrically conductive layer is electrically coupled to the first planar surface via the first surface electrode; and

a second surface electrode covering the second planar surface, wherein the second electrically conductive layer is electrically coupled to the second planar surface via the second surface electrode.

9. The piezoelectric package of claim 1, further comprising:

a first electrical contact electrically coupled to the first electrically conductive layer; and

a second electrical contact electrically coupled to the second electrically conductive layer.

10. The piezoelectric package of claim 9, wherein the first electrically conductive layer has an exposed portion that forms the first electrical contact, and the second electrically conductive layer has an exposed portion that forms the second electrical contact.

11. The piezoelectric package of claim 9, further comprising a connector assembly coupled to the first and second electrical contacts.

12. The piezoelectric package of claim 11, wherein the connector assembly is configured for receiving an external cable.

13. The piezoelectric package of claim 1, further comprising another piezoelectric plate having a third planar surface and a fourth planar surface that are electrically isolated from each other, wherein the first electrically insulative material encapsulates the other piezoelectric plate.

14. The piezoelectric package of claim 13, wherein the first electrically conductive layer is electrically coupled to the third planar surface, and the second electrically conductive layer is electrically coupled to the fourth planar surface, and wherein a ratio of an area of the first electrically conductive layer to the total area of the first planar surface and third planar surface is equal to or greater than unity.

15. The piezoelectric package of claim 13, further comprising:

a third electrically conductive layer electrically coupled to the third planar surface, wherein a ratio of an area of the third electrically conductive layer to the area of the third planar surface is equal to or greater than unity;

a fourth electrically conductive layer electrically coupled to the fourth planar surface.

16. The piezoelectric package of claim 15, wherein a ratio of an area of the fourth electrically conductive layer to the area of the fourth planar surface is equal to or greater than unity.

17. The piezoelectric package of claim 15, wherein the piezoelectric plate and the other piezoelectric plate extend in a same plane.

18. The piezoelectric package of claim 15, wherein the piezoelectric plate and the other piezoelectric plate extend in different planes.

19. The piezoelectric package of claim 1, further comprising a case containing the piezoelectric plate, the first and second electrically conductive layers, and the first electrically insulative material.

20. A system, comprising:

equipment susceptible to vibration;

the piezoelectric package of claim 1 mounted on the equipment; and

electronic circuitry electrically coupled to the piezoelectric package, the electronic circuitry configured for sensing and/or actuating vibrations within the equipment via the piezoelectric package.