Thermal Management for a Ruggedized Electronics Enclosure

• US 20080218970A1
• Filed: 01/25/2008
• Published: 09/11/2008
• Est. Priority Date: 08/30/2002
• Status: Abandoned Application

• Current Assignee: Computer Themis
• Original Assignee: Computer Themis
• Inventors: Smith, Dennis H., Kehret, William E.
• Application Number:
  US12/020,487
• Publication Number:
  US 20080218970A1
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: H05K 7/1434 for electronics exposed to high gravitational force; Cylindrical housings
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

The present invention relates to a liquid cooling assembly for cooling electronic components. The liquid cooling assembly contains a heat spreader plate for providing mechanical support and thermal dissipation; a fluid channel for directing a cooling fluid in the plane of the heat spreader; and a bottom plate for protecting against destructive shock events and for providing thermal dissipation. The present invention also provides a maze structure in the liquid cooling assembly to increase structural stability against destructive shock events. The present invention also relates to a ruggedized electronics enclosure for housing electronic components. A top compartment contains a first electronics layer and a second electronics layer adjacent to said first electronics layer and a cooling assembly. A thermal shunt is configured to channel heat from the first and second electronics layers to the cooling assembly and to provide additional mechanical support to protect against potentially destructive shock events.

Claims

1. A liquid cooling assembly for cooling electronic components, the cooling assembly comprising:

a heat spreader unit;

a structural foam layer, rigidly coupled to said heat spreader unit, providing mechanical support and thermal dissipation for the electronic components;

a fluid channel, rigidly coupled to said structural foam layer, for directing a cooling fluid in a first direction; and

a bottom plate rigidly coupled to said structural foam layer, wherein said heat spreader unit, said structural foam layer, and said bottom plate providing a rigid structure that does not substantially deform in response to one or more destructive shock events, to protect the electronic components against said one or more destructive shock events and to provide thermal dissipation of heat generated by the electronic components.

2. The liquid cooling assembly of claim 1, wherein said structural foam layer further comprises a fluid channel groove.

3. The liquid cooling assembly of claim 1, wherein said fluid channel is adhered to said fluid channel groove by way of a thermally conductive epoxy.

4. The liquid cooling assembly of claim 1, wherein said structural foam layer is formed with a closed-cell foam.

5. The liquid cooling assembly of claim 1, wherein said structural foam layer is formed with a substantially non-compressible material that has a substantially high thermal conductivity

6. The liquid cooling assembly of claim 1, wherein said bottom plate is embedded with a reinforcing fiber to provide structural strength and stiffness for compressive and extension forces, to improve the normal mode mechanical performance of the truss structure.

7. A liquid cooling assembly for cooling electronic components, the cooling assembly comprising:

a heat spreader unit;

a maze structure, rigidly coupled to said heat spreader unit, providing mechanical support and thermal dissipation for the electronic components;

a fluid channel, rigidly coupled to said maze structure, for directing a cooling fluid in a first direction; and

a bottom plate rigidly coupled to said maze structure, wherein said heat spreader unit, said maze structure, and said bottom plate providing a rigid structure that does not substantially deform in response to one or more destructive shock event, to protect the electronic components against said one or more destructive shock events and to provide thermal dissipation of heat generated by the electronic components.

8. The liquid cooling assembly of claim 7, wherein said maze structure further comprises a matrix of cells.

9. The liquid cooling assembly of claim 8, wherein said matrix of cells are fabricated from a high tensile strength, highly thermally conductive material.

10. The liquid cooling assembly of claim 8, wherein said matrix of cells is fabricated from aluminum, graphite, or any particular reinforced carbon fiber.