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Thermal Management for a Ruggedized Electronics Enclosure

  • US 20080218970A1
  • Filed: 01/25/2008
  • Published: 09/11/2008
  • Est. Priority Date: 08/30/2002
  • Status: Abandoned Application
First Claim
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1. A liquid cooling assembly for cooling electronic components, the cooling assembly comprising:

  • a heat spreader unit;

    a structural foam layer, rigidly coupled to said heat spreader unit, providing mechanical support and thermal dissipation for the electronic components;

    a fluid channel, rigidly coupled to said structural foam layer, for directing a cooling fluid in a first direction; and

    a bottom plate rigidly coupled to said structural foam layer, wherein said heat spreader unit, said structural foam layer, and said bottom plate providing a rigid structure that does not substantially deform in response to one or more destructive shock events, to protect the electronic components against said one or more destructive shock events and to provide thermal dissipation of heat generated by the electronic components.

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