Printed circuit (PC) board module with improved heat radiation efficiency

• US 20080218979A1
• Filed: 11/02/2007
• Published: 09/11/2008
• Est. Priority Date: 03/08/2007
• Status: Abandoned Application

• Current Assignee: Samsung SDI Company Limited
• Original Assignee: Samsung SDI Company Limited
• Inventors: Park, Jong-Ho
• Application Number:
  US11/979,462
• Publication Number:
  US 20080218979A1
• Time in Patent Office: Days
• US Class Current: 361/712
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: H05K 3/4652 Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: H05K 7/205 Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201
• CPC Class Codes: H05K 9/0039 Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218

Abstract

A Printed Circuit (PC) board module is structured such that heat generated by an Integrated Circuit (IC) device can be sufficiently radiated to the outside. The PC board module includes: a first PC board having a first conductive ground pad arranged therein; a plurality of via holes contained within the first PC board and positioned below the first ground pad; a plurality of conductive via lines contained within the plurality of via holes; a second PC board arranged below the first PC board; and a second conductive ground pad arranged on the second PC board and contacting the plurality of via lines.

Claims

1. A Printed Circuit (PC) board module comprising:

a first PC board having a conductive first ground pad arranged thereon;

a plurality of via holes arranged within the first PC board and positioned below the first ground pad;

a plurality of conductive via lines contained within the plurality of via holes;

a second PC board arranged below the first PC board; and

a second conductive ground pad arranged on the second PC board and contacting the plurality of via lines.

2. The PC board module of claim 1, further comprising an Integrated Circuit (IC) device arranged on the first ground pad.

3. The PC board module of claim 2, wherein the IC device comprises an IC chip therein, and wherein the PC board module further comprises a ground plate attached to a lower surface of the IC chip and connected to a ground terminal of the IC chip, a lower surface of the ground plate being exposed outside of the IC device.

4. The PC board module of claim 3, wherein the ground plate is attached to the first ground pad with an adhesive.

5. The PC board module of claim 4, wherein the adhesive comprises a conductive adhesive.

6. The PC board module of claim 1, wherein the plurality of via lines are electrically connected to the first ground pad and the second ground pad.

7. The PC board module of claim 1, further comprising an intermediate insulator interposed between the first PC board and the second PC board to insulate the first PC board from the second PC board.

8. The PC board module of claim 7, further comprising a plurality of other via lines contained within the intermediate insulator to electrically connect the plurality of via lines arranged within the first PC board to the second ground pad.

9. The PC board module of claim 7, wherein the intermediate insulator comprises a Pressure Conductive Rubber (PCR), and wherein a portion of the intermediate insulator becomes conductive when pressed.

10. The PC board module of claim 2, wherein the first ground pad has a wider area than that of the IC device.

11. A Printed Circuit (PC) board module comprising:

a PC board having a conductive first ground pad arranged thereon;

a plurality of via holes contained within the PC board and positioned below the first ground pad;

a plurality of conductive via lines contained within the plurality of via holes; and

a second ground pad arranged below the PC board and contacting the plurality of via lines.

12. The PC board module of claim 11, wherein the first ground pad has a wider area than that of the second ground pad.

13. The PC board module of claim 11, wherein the plurality of via lines comprise solder.

14. The PC board module of claim 11, further comprising an Integrated Circuit (IC) device arranged on the first ground pad.

15. The PC board module of claim 14, wherein the IC device comprises an IC chip therein, and wherein the PC board module further comprises a ground plate attached to a lower surface of the IC chip and connected to a ground terminal of the IC chip, a lower surface of the ground plate being exposed outside of the IC device.

16. The PC board module of claim 15, wherein the ground plate is attached to the first ground pad with a conductive adhesive.