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METHOD FOR INCREASING MECHANICAL STRENGTH OF DIELECTRIC FILM BY USING SEQUENTIAL COMBINATION OF TWO TYPES OF UV IRRADIATION

  • US 20080220619A1
  • Filed: 03/09/2007
  • Published: 09/11/2008
  • Est. Priority Date: 03/09/2007
  • Status: Abandoned Application
First Claim
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1. A method for increasing mechanical strength of a dielectric film, comprising the steps of:

  • providing an initial dielectric film containing porogen;

    irradiating the initial dielectric film with first UV light having a first wavelength which is substantially or nearly similar to a maximum light absorption wavelength of the porogen for removing the porogen, wherein the irradiation of the first UV light continues until a refractive index of the initial dielectric film reaches substantially or nearly a minimum value, the irradiation of the first UV light being such that the refractive index reaches substantially or nearly the minimum value at least after 200 seconds of the irradiation; and

    thenirradiating the porogen-removed dielectric film with second UV light having a second wavelength which is shorter than the first wavelength, thereby increasing mechanical strength of the dielectric film.

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