METHOD FOR INCREASING MECHANICAL STRENGTH OF DIELECTRIC FILM BY USING SEQUENTIAL COMBINATION OF TWO TYPES OF UV IRRADIATION
First Claim
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1. A method for increasing mechanical strength of a dielectric film, comprising the steps of:
- providing an initial dielectric film containing porogen;
irradiating the initial dielectric film with first UV light having a first wavelength which is substantially or nearly similar to a maximum light absorption wavelength of the porogen for removing the porogen, wherein the irradiation of the first UV light continues until a refractive index of the initial dielectric film reaches substantially or nearly a minimum value, the irradiation of the first UV light being such that the refractive index reaches substantially or nearly the minimum value at least after 200 seconds of the irradiation; and
thenirradiating the porogen-removed dielectric film with second UV light having a second wavelength which is shorter than the first wavelength, thereby increasing mechanical strength of the dielectric film.
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Abstract
A method for increasing mechanical strength of a dielectric film includes: providing an initial dielectric film containing porogen; irradiating the initial dielectric film with first UV light having a first wavelength which is substantially or nearly similar to a maximum light absorption wavelength of the porogen for removing the porogen; and then irradiating the porogen-removed dielectric film with second UV light having a second wavelength which is shorter than the first wavelength, thereby increasing mechanical strength of the dielectric film.
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13 Claims
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1. A method for increasing mechanical strength of a dielectric film, comprising the steps of:
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providing an initial dielectric film containing porogen; irradiating the initial dielectric film with first UV light having a first wavelength which is substantially or nearly similar to a maximum light absorption wavelength of the porogen for removing the porogen, wherein the irradiation of the first UV light continues until a refractive index of the initial dielectric film reaches substantially or nearly a minimum value, the irradiation of the first UV light being such that the refractive index reaches substantially or nearly the minimum value at least after 200 seconds of the irradiation; and
thenirradiating the porogen-removed dielectric film with second UV light having a second wavelength which is shorter than the first wavelength, thereby increasing mechanical strength of the dielectric film. - View Dependent Claims (2, 3, 4, 5, 7, 8, 9, 10, 11, 12, 13)
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6. (canceled)
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