Solar Cell (Sliver) Sub-Module Formation
First Claim
1. A solar cell sub-module for a photovoltaic device, including a plurality of elongate solar cells mounted in a structure that maintains the elongate solar cells in a longitudinally parallel and generally coplanar configuration, the structure providing one or more conductive pathways electrically interconnecting the elongate solar cells.
4 Assignments
0 Petitions
Accused Products
Abstract
A solar cell sub-module (100) for a photovoltaic device, including a plurality of elongate solar cells (slivers) (101) mounted in a structure that maintains the elongate solar cells in a longitudinally parallel and generally coplanar configuration, the structure providing one or more conductive pathways (201) electrically interconnecting the elongate solar cells (101). Also claimed are inventions related to releasing elongate substrate from a wafer frame; providing a plurality of mutually spaced elongate storage bins with a particular spacing; dispensing elongate solar cells into an alignment jig and attaching the cells to a substrate; engaging a length of electrical interconnect with an engagement tool having spaced engagement sections and applying a cutting tool; forming an electrical connection in a photovoltaic module with a conductor defining an indirect path between locations to compensate for thermal expansion; maintaining the solar cell orientation of sliver solar cells when releasing them from a wafer frame; engaging only opposing faces of elongate substrates, interconnected by a wafer frame, when releasing them; storing elongate substrate in a stacked configuration with a translation mechanism.
105 Citations
121 Claims
- 1. A solar cell sub-module for a photovoltaic device, including a plurality of elongate solar cells mounted in a structure that maintains the elongate solar cells in a longitudinally parallel and generally coplanar configuration, the structure providing one or more conductive pathways electrically interconnecting the elongate solar cells.
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28. A method of forming a solar cell sub-module for a photovoltaic device including the steps of:
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mounting a plurality of elongate solar cells in a structure that maintains the elongate solar cells in a substantially longitudinally parallel and generally co-planar configuration; and establishing one or more conductive pathways extending through the structure to electrically interconnect the elongate solar cells. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36)
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37. A substrate release process, including:
- receiving a wafer including a plurality of elongate substrates interconnected by lateral wafer frame portions, the wafer further including proximal and distal wafer frame portions;
removing at least one of said proximal and distal wafer frame portions to expose a face of a corresponding one of said elongate substrates; engaging at least one of the lateral wafer frame portions to secure the plurality of elongate substrates, without engaging the edges of the plurality of elongate substrates; applying elongate substrate engaging means to the exposed face of the exposed elongate substrate to engage the exposed elongate substrate; and moving the elongate substrate engaging means away from the plurality of elongate substrates to release the exposed elongate substrate from the remaining elongate substrates. - View Dependent Claims (38, 39)
- receiving a wafer including a plurality of elongate substrates interconnected by lateral wafer frame portions, the wafer further including proximal and distal wafer frame portions;
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40. A substrate release process, including:
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receiving a plurality of wafers, each of the wafers including a plurality of elongate substrates interconnected by lateral wafer frame portions, the wafers further including proximal and distal wafer frame portions; removing at least one of said proximal and distal wafer frame portions from each of the wafers to expose a face of a corresponding one of said elongate substrates of each wafer; engaging at least one of the lateral wafer frame portions of each wafer to secure the plurality of elongate substrates, without engaging the edges of the plurality of elongate substrates; wherein the engaged wafers are arranged so that the exposed elongate substrates are presented as an array of mutually spaced elongate substrates. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55)
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56. An elongate substrate dispensing process, including:
providing a plurality of mutually spaced elongate substrate storage bins, each of said elongate substrate storage bins having a stack of elongate substrates stored therein, the spacing between the elongate substrate storage bins being selected to provide a desired spacing of elongate substrates in a solar cell sub-module to be assembled from the stored elongate substrates.
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57. A process for forming a solar cell sub-module for a photovoltaic device including:
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dispensing elongate solar cells from an elongate substrate dispensing unit into respective slots of an alignment jig; and attaching the elongate solar cells to a substrate, crossbeam or electrical interconnects to form the solar cell sub-module.
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58. An elongate substrate handling system, including:
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an elongate substrate dispensing unit for storing and dispensing one or more stacks of elongate substrates; and an alignment jig having mutually spaced slots for receiving respective elongate substrates dispensed from the storage unit. - View Dependent Claims (59, 60, 61)
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62. A process for forming a solar cell sub-module for a photovoltaic device including:
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engaging a length of electrical interconnect with an engagement tool having a plurality of mutually spaced engagement sections so that only mutually spaced regions of the electrical interconnect are engaged by the tool; and applying a cutting tool to locations of the electrical interconnect between the engaged regions to cut the engaged electrical interconnect into corresponding lengths of the electrical interconnect. - View Dependent Claims (63, 64, 65, 66)
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- 67. A process for forming an electrical connection in a photovoltaic module, including attaching an electrical conductor to mutually spaced locations of a support, said electrical conductor defining an indirect path between said locations to accommodate different rates of thermal expansion of said electrical conductor and said support, and thereby to maintain an electrical connection between said locations.
- 74. A process for forming an electrical connector for a photovoltaic module, including deforming a length of an electrically conductive substance to define an indirect path between at least two mutually spaced attachment locations along said length to accommodate different rates of thermal expansion of said electrically conductive substance and a support, and thereby to maintain an electrical connection between said attachment locations when at least part of said length of said electrically conductive substance is attached to said support at said mutually spaced attachment locations.
- 82. A process for forming electrical connections between elongate solar cells in a photovoltaic module, including attaching a bus bar to mutually spaced attachment locations of a substrate, said bus bar defining an indirect path between said locations to accommodate different rates of thermal expansion of said bus bar and said substrate, and thereby to maintain an electrical connection between said attachment locations.
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87. (canceled)
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88. An electrical connector for a photovoltaic module, said electrical connector being adapted for attachment to mutually spaced attachment locations of a support, said electrical conductor defining an indirect path between said locations to accommodate different rates of thermal expansion of said electrical conductor and said support, and thereby to maintain an electrical connection between said attachment locations.
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89. A system for forming electrical connectors for a photovoltaic module, the system including a pair of rotating rollers having mutually opposed projections and recesses adapted to deform a length of an electrically conductive substance fed between said rollers to define an indirect path between at least two mutually spaced attachment locations along said length to accommodate different rates of thermal expansion of said electrically conductive substance and a support, and thereby to maintain an electrical connection between said attachment locations when at least part of said length of said electrically conductive substance is attached to said support at said mutually spaced attachment locations.
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94. A sliver removal process, including:
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receiving a plurality of mutually spaced sliver solar cells interconnected by one or more wafer frame portions, each of said sliver solar cells having outwardly facing edges having respective polarities and solar cell faces perpendicular to said edges; and releasing the sliver solar cells from the one or more wafer frame portions in a substantially simultaneous manner whilst maintaining the relative orientation of said solar cell edges to provide a plurality of released sliver solar cells whose edges of a selected polarity have the same orientation. - View Dependent Claims (120)
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95. A sliver removal process, including:
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receiving a plurality of slivers interconnected and maintained in a mutually spaced arrangement by one or more connecting portions, each of said slivers having outwardly facing edges and faces perpendicular to said edges, the edges of each sliver including a first edge and a second edge, wherein the first edges of said slivers have a first orientation; and releasing the slivers from the one or more connecting portions in a substantially simultaneous manner whilst maintaining the relative orientation of said edges to provide a plurality of released slivers wherein the first edges of the released slivers have the same orientation. - View Dependent Claims (96, 97, 98, 99, 100, 101, 121)
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102. (canceled)
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103. A sliver removal apparatus, including:
a clamp having two opposing portions for engaging respective edges or one or more connecting portions of a plurality of mutually spaced slivers interconnected by said one or more connecting portions, each of said slivers having faces perpendicular to said edges, said faces having a relative orientation;
wherein said two opposing portions include alignment slots for receiving respective guides of a sliver storage device in a direction substantially transverse to longitudinal axes of said slivers.- View Dependent Claims (104, 105)
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106. A sliver removal apparatus, including a sliver storage device having a plurality of elongated guides for mating with respective alignment slots in a clamp engaging one or more connecting portions or edges of a plurality of mutually spaced slivers interconnected by said one or more connecting portions, said edges having a relative orientation;
- wherein said elongated guides are arranged adjacent and substantially perpendicular to opposing edges of said slivers when said guides are mated with said slots.
- View Dependent Claims (107, 108)
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109. A sliver removal clamp having two opposing portions for engaging one or more connecting portions of a plurality of mutually spaced slivers interconnected by one or more connecting portions, each of said slivers having outwardly directed edges and faces perpendicular to said edges;
- wherein said two opposing portions include openings to allow edges of said slivers to be engaged to allow substantially simultaneous removal of said slivers from said one or more connecting portions whilst retaining relative orientation of said edges.
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110. A process for releasing elongate substrates from a wafer incorporating a plurality of elongate substrates interconnected by wafer frame portions, including:
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engaging only opposing faces of each elongate substrate, the engaged faces being in the same plane as the wafer surfaces; removing the wafer frame portions to disconnect the elongate substrates from one another; and disengaging one of the faces of each elongate substrate, the other face of each elongate substrate remaining engaged.
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111. A process for releasing elongate substrates from a wafer incorporating an array of elongate substrates interconnected by wafer frame portions, including:
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engaging only selected non-adjacent ones of the elongate substrates and disconnecting the engaged substrates from the other elongate substrates in the array; and depositing the engaged elongate substrates in respective mutually spaced storage bins of a storage unit, the spacing between the storage bins corresponding to the spacing between the engaged elongate substrates. - View Dependent Claims (112)
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113. A process for releasing elongate substrates from a wafer incorporating an array of elongate substrates interconnected by wafer frame portions, including:
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(i) engaging a selected one of the elongate substrates and disconnecting the engaged substrate from the other elongate substrates in the array; (ii) depositing the engaged elongate substrate in a storage unit; and (iii) repeating steps (i) and (ii) to form a stack of elongated substrates in the storage unit.
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- 114. A storage apparatus for storing elongate substrates in a stacked configuration, the storage apparatus including a translation mechanism for translating a stack of stored elongate substrates to allow receipt of a subsequently received elongate substrate for storage in the storage apparatus.
Specification