PACKAGING METHODS FOR IMAGER DEVICES

• US 20080224192A1
• Filed: 03/14/2007
• Published: 09/18/2008
• Est. Priority Date: 03/14/2007
• Status: Active Grant

• Current Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Original Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Inventors: England, Luke, Kinsman, Larry
• Granted Patent: US 7,919,410 B2
• Time in Patent Office: Days
• US Class Current: 257/294
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2221/6834 used to protect an active side of a device or wafer
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2221/6835 used as a support during build up manufacturing of active devices
• CPC Class Codes: H01L 2221/68377 with parts of the auxiliary support remaining in the finished device
• CPC Class Codes: H01L 2223/6622 Coaxial feed-throughs in active or passive substrates
• CPC Class Codes: H01L 2224/02372 connecting to a via connection in the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/13024 the bump connector being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/221 Disposition
• CPC Class Codes: H01L 2224/274 by blanket deposition of the material of the layer connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/82039 using a laser
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/27 : Manufacturing methods
• CPC Class Codes: H01L 27/14634 : Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 : Interconnect structures
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/16151 : Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16235 : Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

An imager device is disclosed which includes at least one photosensitive element positioned on a front surface of a substrate and a conductive structure extending at least partially through an opening defined in the substrate to conductively couple to an electrical contact or bond pad on the first surface. An insulating material of a conductive laminate film and/or a mold compound material is positioned within the opening between at least a portion of the conductive structure and the substrate. Also disclosed is a device that comprises a substrate and a plurality of openings in the substrate, wherein each of the openings is adapted to be positioned above an imager device when the substrate is positioned above and secured to an imager substrate. A method of forming an imager device is also disclosed.

Claims

1. An imager device, comprising:

at least one photosensitive element positioned on a front surface of a substrate;

at least one electrical contact structure positioned on the front surface of the substrate;

a conductive structure extending at least partially through an opening defined in the substrate, the conductive structure being conductively coupled to the at least one electrical contact; and

a portion of an insulating material of a laminate structure positioned within the opening between at least a portion of the conductive structure and the substrate.

2. The device of claim 1, wherein the insulating material comprises at least one of a resin, a polymer and an adhesive.

3. The device of claim 1, wherein the insulating material overfills the opening and covers at least a portion of a back surface of the substrate.

4. The device of claim 3, wherein the insulating material overfills the opening and covers a substantial entirety of a back surface of the substrate.

5. The device of claim 1, wherein the conductive structure is conductively coupled to a back surface of the at least one electrical contact.

6. The device of claim 1, wherein the insulating material overfills the opening and the insulating material has a surface that is spaced apart and substantially parallel to a back surface of the substrate.

7. The device of claim 1, wherein the insulating material within the opening is positioned between the entirety of the conductive structure within the opening and the substrate.

8. The device of claim 1, further comprising a conductive bump positioned apart from a back surface of the substrate, the conductive bump being conductively coupled to the conductive structure within the opening in the substrate and to another structure.

9. The device of claim 1, wherein the conductive structure comprises a conductive paste.

10. The device of claim 1, wherein the conductive structure comprises a metal.

11. The device of claim 9, wherein the conductive structure comprises copper.

12. The device of claim 1, wherein the opening is defined by sloped sidewalls formed in the substrate.

13. The device of claim 1, further comprising a lens support structure and at least one lens positioned above the at least one photosensitive element.

14. The device of claim 1, wherein the at least one photosensitive element is a portion of a CMOS imager device.

15. An imager device, comprising:

at least one photosensitive element positioned on a front surface of a substrate;

at least one electrical contact structure positioned on the front surface of the substrate;

a conductive structure extending at least partially through an opening defined in the substrate, the conductive structure being conductively coupled to the at least one electrical contact; and

a mold compound material positioned within the opening between at least a portion of the conductive structure and the substrate.

16. The device of claim 15, wherein the mold compound material overfills the opening and covers at least a portion of a back surface of the substrate.

17. The device of claim 16, wherein the mold compound material overfills the opening and covers a substantial entirety of a back surface of the substrate.

18. The device of claim 16, wherein the mold compound material has a surface that extends beyond a back surface of the substrate.

19. The device of claim 16, wherein the mold compound material overfills the opening and the mold compound has a surface that is spaced apart and substantially parallel to a back surface of the substrate.

20. The device of claim 15, wherein the mold compound material within the opening is positioned between the entirety of the conductive structure within the opening and the substrate.

21. The device of claim 15, further comprising a conductive bump positioned apart from a back surface of the substrate, the conductive bump being conductively coupled to the conductive structure within the opening in the substrate and to another structure.

22. The device of claim 15, wherein the conductive structure comprises a conductive paste.

23. The device of claim 15, wherein the conductive structure comprises a metal.

24. The device of claim 23, wherein the conductive structure comprises copper.

25. The device of claim 15, wherein the opening is defined by sloped sidewalls formed in the substrate.

26. The device of claim 15, further comprising a lens support structure and at least one lens positioned above the at least one photosensitive element.

27. The device of claim 15, wherein the at least one photosensitive element is a portion of a CMOS imager device.

28. A device that is adapted to be positioned above and secured to at least a portion of an imager substrate that comprises a plurality of imager devices, comprising:

a substrate; and

a plurality of openings in the substrate, each of the openings adapted to be positioned above and substantially aligned with an imager device when the substrate is positioned above and secured to the imager substrate.

29. The device of claim 28, wherein the substrate is comprised of at least one of silicon and glass.

30. The device of claim 28, wherein the substrate is comprised of a transparent material.

31. The device of claim 28, wherein the substrate is adapted to be secured to the imager substrate by an adhesive material.

32. The device of claim 28, wherein the substrate has the same number of openings as there are imager devices on the imager substrate.

33. The device of claim 28, wherein the substrate has a fewer number of openings than there are imager devices on the imager substrate.

34. The device of claim 28, wherein the substrate has a surface area that is approximately the same as a surface area of the imager substrate.

35. The device of claim 28, wherein the substrate has a surface area that is less than a surface area of the imager substrate.

36. The device of claim 28, further comprising at least one lens mounted above each of the plurality of openings in the substrate.

37. The device of claim 28, further comprising a lens mounting structure that is positioned above each of the openings.

38. The device of claim 28, wherein each of the openings defines at least one support structure that is adapted to have a lens mounted thereto.

39. The device of claim 38, wherein the support structure comprises a mounting surface.

40. The device of claim 28, wherein each of the openings defines at least one substantially rectangular lens mounting surface.

41. The device of claim 28, further comprising the imager substrate, wherein the substrate is secured to the imager substrate by an adhesive material.

42. A method of forming an imager device, comprising:

forming a first opening in a back surface of an imager substrate comprising at least one photosensitive element and at least one electrical contact on a front surface of the imager substrate, the first opening permitting conductive coupling to a portion of a back surface of the electrical contact;

positioning a portion of an insulating material of a laminate structure in the first opening;

forming a second opening in the insulating material within the first opening, the second opening permitting conductive coupling to a portion of the back surface of the electrical contact, wherein, after the formation of the second opening, a portion of the insulating material remains within the first opening; and

forming a conductive structure within the second opening, wherein the insulating material remaining within the first opening after the formation of the second opening is positioned between at least a portion of the conductive structure and the imager substrate.

43. The method of claim 42, wherein the insulating material comprises at least one of a resin, a polymer and an adhesive.

44. The method of claim 42, wherein forming the first opening comprises forming the first opening such that the first opening comprises sloped sidewalls.

45. The method of claim 42, wherein positioning the portion of an insulating material of the laminate structure in the first opening comprises performing a vacuum lamination process to position a portion of an insulating material of the laminate structure in the first opening.

46. The method of claim 42, wherein forming the second opening in the insulating material comprises performing a laser drilling process to form the second opening in the insulating material.

49. The method of claim 42, wherein forming the conductive structure comprises positioning a conductive paste in the second opening.

50. The method of claim 42, wherein forming the conductive structure comprises performing at least one deposition process to form a conductive material within the second opening.

51. The method of claim 42, further comprising forming a conductive bump that is conductively coupled to the conductive structure.

47. The method of claim 47, wherein positioning a portion of the insulating material of the laminate structure in the first opening comprises:

providing a laminated conductive film comprising an insulating material and a conductive layer;

positioning the laminated conductive film adjacent the back surface of the substrate; and

performing a vacuum lamination process to position a portion of the insulating material of the laminated conductive film into the first opening.

48. The method of claim 47, further comprising:

forming an opening in the conductive layer of the laminated conductive film by performing at least one etching process, the opening exposing a portion of the insulating material; and

forming the second opening in the insulating material by performing a laser drilling process.

52. A method of forming an imager device, comprising:

forming a first opening in a back surface of an imager substrate comprising at least one photosensitive element and at least one electrical contact on a front surface of the imager substrate, the first opening permitting conductive coupling to a portion of a back surface of the electrical contact;

forming a mold compound material in the first opening;

forming a second opening in the mold compound material within the first opening, the second opening permitting conductive coupling to a portion of the back surface of the electrical contact, wherein, after the formation of the second opening, a portion of the mold compound material remains within the first opening; and

forming a conductive structure within the second opening, wherein the mold compound material remaining after the formation of the second opening is positioned between at least a portion of the conductive structure and the imager substrate.

53. The method of claim 52, wherein the mold compound material comprises at least one of a liquid mold compound material and a dry mold compound material.

54. The method of claim 52, wherein forming the first opening comprises performing an etching process to form the first opening.

55. The method of claim 52, wherein forming the first opening comprises forming the first opening such that the first opening comprises sloped sidewalls.

56. The method of claim 52, wherein forming the mold compound material in the first opening comprises performing an injecting molding process.

57. The method of claim 52, wherein forming the second opening in the mold compound material comprises performing a laser drilling process to form the second opening in the mold compound material.

58. The method of claim 52, wherein forming the mold compound material in the first opening comprises:

positioning the imager substrate in a mold; and

injecting the mold compound material into the mold.

59. The method of claim 52, wherein forming the conductive structure comprises positioning a conductive paste within the second opening.

60. The method of claim 52, wherein forming the conductive structure comprises performing at least one deposition process to form a conductive material within the second opening.

61. The method of claim 52, further comprising forming a conductive bump that is conductively coupled to the conductive structure.

62. A method, comprising:

providing an imager substrate comprised of a plurality of imager devices; and

securing a substrate comprised of a plurality of openings to the imager substrate, wherein each of the openings in the substrate is positioned above and substantially aligned with an imager device on the imager substrate.

63. The method of claim 62, wherein securing the substrate to the imager substrate comprises positioning an adhesive material on at least one of the substrate and the imager substrate.

64. The method of claim 62, wherein the substrate comprises the same number of openings in the substrate as there are imager devices on the imager substrate.

65. The method of claim 62, wherein the substrate comprises a fewer number of openings in the substrate than there are imager devices on the imager substrate.

66. The method of claim 62, wherein the substrate has a surface area that is approximately the same as a surface area of the imager substrate.

67. The method of claim 62, wherein the substrate has a surface area that is less than a surface area of the imager substrate.

68. The method of claim 62, further comprising positioning at least one lens above each of the plurality of openings in the substrate.

69. The method of claim 62, further comprising positioning a lens mounting structure above each of the openings in the substrate.

70. The method of claim 62, wherein each of the openings in the substrate define at least one support structure that is adapted to have a lens mounted thereto.

71. The method of claim 70, wherein the support structure comprises a mounting surface.

72. The method of claim 62, wherein each of the openings defines at least one substantially rectangular lens mounting surface.