PACKAGING METHODS FOR IMAGER DEVICES
First Claim
1. An imager device, comprising:
- at least one photosensitive element positioned on a front surface of a substrate;
at least one electrical contact structure positioned on the front surface of the substrate;
a conductive structure extending at least partially through an opening defined in the substrate, the conductive structure being conductively coupled to the at least one electrical contact; and
a portion of an insulating material of a laminate structure positioned within the opening between at least a portion of the conductive structure and the substrate.
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Accused Products
Abstract
An imager device is disclosed which includes at least one photosensitive element positioned on a front surface of a substrate and a conductive structure extending at least partially through an opening defined in the substrate to conductively couple to an electrical contact or bond pad on the first surface. An insulating material of a conductive laminate film and/or a mold compound material is positioned within the opening between at least a portion of the conductive structure and the substrate. Also disclosed is a device that comprises a substrate and a plurality of openings in the substrate, wherein each of the openings is adapted to be positioned above an imager device when the substrate is positioned above and secured to an imager substrate. A method of forming an imager device is also disclosed.
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Citations
72 Claims
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1. An imager device, comprising:
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at least one photosensitive element positioned on a front surface of a substrate; at least one electrical contact structure positioned on the front surface of the substrate; a conductive structure extending at least partially through an opening defined in the substrate, the conductive structure being conductively coupled to the at least one electrical contact; and a portion of an insulating material of a laminate structure positioned within the opening between at least a portion of the conductive structure and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An imager device, comprising:
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at least one photosensitive element positioned on a front surface of a substrate; at least one electrical contact structure positioned on the front surface of the substrate; a conductive structure extending at least partially through an opening defined in the substrate, the conductive structure being conductively coupled to the at least one electrical contact; and a mold compound material positioned within the opening between at least a portion of the conductive structure and the substrate. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A device that is adapted to be positioned above and secured to at least a portion of an imager substrate that comprises a plurality of imager devices, comprising:
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a substrate; and a plurality of openings in the substrate, each of the openings adapted to be positioned above and substantially aligned with an imager device when the substrate is positioned above and secured to the imager substrate. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41)
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42. A method of forming an imager device, comprising:
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forming a first opening in a back surface of an imager substrate comprising at least one photosensitive element and at least one electrical contact on a front surface of the imager substrate, the first opening permitting conductive coupling to a portion of a back surface of the electrical contact; positioning a portion of an insulating material of a laminate structure in the first opening; forming a second opening in the insulating material within the first opening, the second opening permitting conductive coupling to a portion of the back surface of the electrical contact, wherein, after the formation of the second opening, a portion of the insulating material remains within the first opening; and forming a conductive structure within the second opening, wherein the insulating material remaining within the first opening after the formation of the second opening is positioned between at least a portion of the conductive structure and the imager substrate. - View Dependent Claims (43, 44, 45, 46, 49, 50, 51)
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47. The method of claim 47, wherein positioning a portion of the insulating material of the laminate structure in the first opening comprises:
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providing a laminated conductive film comprising an insulating material and a conductive layer; positioning the laminated conductive film adjacent the back surface of the substrate; and performing a vacuum lamination process to position a portion of the insulating material of the laminated conductive film into the first opening. - View Dependent Claims (48)
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52. A method of forming an imager device, comprising:
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forming a first opening in a back surface of an imager substrate comprising at least one photosensitive element and at least one electrical contact on a front surface of the imager substrate, the first opening permitting conductive coupling to a portion of a back surface of the electrical contact; forming a mold compound material in the first opening; forming a second opening in the mold compound material within the first opening, the second opening permitting conductive coupling to a portion of the back surface of the electrical contact, wherein, after the formation of the second opening, a portion of the mold compound material remains within the first opening; and forming a conductive structure within the second opening, wherein the mold compound material remaining after the formation of the second opening is positioned between at least a portion of the conductive structure and the imager substrate. - View Dependent Claims (53, 54, 55, 56, 57, 58, 59, 60, 61)
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62. A method, comprising:
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providing an imager substrate comprised of a plurality of imager devices; and securing a substrate comprised of a plurality of openings to the imager substrate, wherein each of the openings in the substrate is positioned above and substantially aligned with an imager device on the imager substrate. - View Dependent Claims (63, 64, 65, 66, 67, 68, 69, 70, 71, 72)
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Specification