Physical quantity sensor and semiconductor device having package and cover

• US 20080224304A1
• Filed: 02/26/2008
• Published: 09/18/2008
• Est. Priority Date: 03/12/2007
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Watanabe, Tatsuya, Imoto, Masahiko
• Granted Patent: US 7,719,006 B2
• Time in Patent Office: Days
• US Class Current: 257/702
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A semiconductor device includes: a semiconductor chip; a package for accommodating the chip, wherein the package has a box shape with an opening and a bottom; and a cover for sealing the opening of the package. The semiconductor chip is disposed on the bottom of the package. The cover has a plate shape. The cover includes a protrusion, which is disposed at a center of the plate shape. The protrusion protrudes toward an outside of the package.

Claims

1. A semiconductor device comprising:

a semiconductor chip;

a package for accommodating the chip, wherein the package has a box shape with an opening and a bottom; and

a cover for sealing the opening of the package, wherein;

the semiconductor chip is disposed on the bottom of the package,

the cover has a plate shape,

the cover includes a protrusion, which is disposed at a center of the plate shape, and

the protrusion protrudes toward an outside of the package.

2. The semiconductor device according to claim 1, wherein

the protrusion has a dome shape.

3. The semiconductor device according to claim 2, wherein

the protrusion has an outline, which is one of a circular shape, a polygonal shape and an ellipsoid shape.

4. The semiconductor device according to claim 1, wherein

the protrusion has a height, which is equal to or larger than a thickness of the cover.

5. The semiconductor device according to claim 1, wherein

the semiconductor chip detects acceleration.

6. A physical quantity sensor comprising:

a case made of resin;

a connector terminal molded in the case; and

a sensing element molded in the case, wherein

the sensing element is electrically coupled with the connector terminal,

the sensing element includes;

a semiconductor chip;

a package for accommodating the chip, wherein the package has a box shape with an opening and a bottom; and

a cover for sealing the opening of the package,

the semiconductor chip is disposed on the bottom of the package,

the cover has a plate shape,

the cover includes a protrusion, which is disposed at a center of the plate shape, and

the protrusion protrudes toward an outside of the package.

7. The sensor according to claim 6, wherein

the protrusion has a dome shape,

the protrusion has an outline, which is one of a circular shape, a polygonal shape and an ellipsoid shape, and

the protrusion has a height, which is equal to or larger than a thickness of the cover.