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Semiconductor device and manufacturing method thereof

  • US 20080224940A1
  • Filed: 03/07/2008
  • Published: 09/18/2008
  • Est. Priority Date: 03/13/2007
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a semiconductor element; and

    a sealing layer with a thickness greater than or equal to 10 μ

    m and less than or equal to 100 μ

    m, including a fibrous body and an organic resin, the fibrous body being impregnated with the organic resin,wherein the sealing layer is fixed to at least one of surfaces of the semiconductor element.

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