Light sensor embedded on printed circuit board

• US 20080225395A1
• Filed: 03/14/2008
• Published: 09/18/2008
• Est. Priority Date: 01/10/2006
• Status: Active Grant

• Current Assignee: Guardian Glass LLC (KOCH Industries Incorporated)
• Original Assignee: Guardian Industries Corporation (KOCH Industries Incorporated)
• Inventors: Veerasamy, Vijayen S.
• Granted Patent: US 7,504,957 B2
• Time in Patent Office: Days
• US Class Current: 359/601
• CPC Class Codes: B32B 17/10036 comprising two outer glass sheets
• CPC Class Codes: B32B 17/10174 Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
• CPC Class Codes: B32B 17/10761 containing vinyl acetal
• CPC Class Codes: B32B 17/10788 containing ethylene vinylacetate
• CPC Class Codes: B60S 1/0822 characterized by the arrangement or type of detection means
• CPC Class Codes: B60S 1/0825 Capacitive rain sensor
• CPC Class Codes: B60S 1/087 including an ambient light sensor control of vehicle lights B60Q
• CPC Class Codes: G01D 5/2405 by varying dielectric
• CPC Class Codes: G01N 2021/435 Sensing drops on the contact surface
• CPC Class Codes: G01N 21/25 Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2201/09072 Hole or recess under component or special relationship between hole and component
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence

Abstract

A system and/or method for sensing the presence of moisture (e.g., rain) and/or other material(s) on a window such as a vehicle window (e.g., vehicle windshield, sunroof or backlite). Such techniques may be used in connection with a light sensor. In certain example embodiments, a flexible printed circuit board (PCB) includes a light sensor comprising a light sensor flip-chip, with the light sensor flip-chip including at least two light sensor arrays, and with each said sensor array being configured to sense light of a predetermined wavelength. An adhesive bonds the light sensor to the PCB. A hole is formed in the PCB and the opaque layer so as to allow the light sensor arrays to see through the hole formed in the PCB and the opaque layer. A state of the vehicle lights is settable in dependence on the light sensor. The PCB is located in or is supported by the vehicle windshield.

Claims

1. A light sensor for a vehicle, comprising:

a printed circuit board (PCB) to be supported by a vehicle window, the PCB comprising first and second outer layers and at least one inner layer, the first outer layer adapted to be closest to an interior of the vehicle and the second outer layer adapted to be closest to an exterior of the vehicle;

a light sensor flip-chip mounted to an inner surface of the first outer layer of the PCB, the light sensor flip-chip including at least two light sensor arrays, each said sensor array being configured to sense light of a predetermined wavelength;

programmed logic circuitry configured to set a state of the vehicle lights in dependence on the light sensor; and

wherein the at least two light sensor arrays are arranged so as to receive radiation through at least one hole formed in the PCB, the hole in the PCB acting as a lens.

2. The light sensor of claim 1, further comprising first and second inner layers, the first and second inner layers being substantially metallic.

3. The light sensor of claim 1, wherein the first and second outer layers are formed from a flexible polymer.

4. The light sensor of claim 1, wherein the light sensor is bonded to the vehicle window via an adhesive tape, and wherein the light sensor is supported by an interior surface of the vehicle window.

5. The light sensor of claim 1, wherein an opaque layer is provided on the window so as to shield the PCB from a view of a passenger inside the vehicle.

6. The light sensor of claim 1, wherein the opaque layer is a black frit and wherein a hole is formed in the black frit so as to correspond with the hole formed in the PCB.

7. The light sensor of claim 1, wherein the window is one of a vehicle windshield, a vehicle backlite, and/or a vehicle sunroof.

8. The light sensor of claim 1, further comprising a plurality of ceramic legs formed on the light sensor flip-chip that include solder connection pins for connecting the flip to the PCB.

9. The light sensor of claim 1, wherein light sensor operates free from any lenses apart from the hole in the PCB.

10. The light sensor of claim 1, wherein each said light sensor array is configured to sense a presence and intensity of light in a wavelength and to output the presence and intensity of light via a respective channel.

11. The light sensor of claim 10, wherein a first channel is a broadband channel, a second channel is an IR light channel, and a third channel is a visible light channel.

12. The light sensor of claim 10, further comprising channel analyzing means for determining whether to switch an on/off state of the vehicle lights.

13. The light sensor of claim 10, wherein the first array includes bare silicon covered by metal, the first array being configured to sense a presence and intensity of light in a broadband wavelength and in a visible light wavelength, and

wherein the second array is configured to sense a presence and intensity of light in an IR wavelength.

14. The light sensor of claim 11, wherein the first channel operates over a wavelength range of about 300-1100 nm with a peak responsivity at about 650 nm, wherein the second channel operates over a wavelength range of about 500-1100 nm with a peak responsivity at about 800 nm, and wherein the third channel operates over a wavelength range of about 400-550 nm with a peak responsivity at about 500 nm.

15. The light sensor of claim 1, further comprising a refractive index lens.

16. A flexible printed circuit board (PCB) supported by a vehicle window, comprising:

a first outer layer, the first outer layer being closest to an interior of the vehicle and being formed from a flexible polymer;

a second outer layer, the second outer layer being closest to an exterior of the vehicle and being formed from a flexible polymer;

at least one substantially metallic inner layer;

a light sensor comprising a light sensor mounted to an inner surface of the first outer layer of the PCB, the light sensor including at least two light sensor arrays, each said sensor array being configured to sense light of a predetermined wavelength; and

programmed logic circuitry configured to set a state of the vehicle lights in dependence on the light sensor,

wherein the at least two light sensor arrays are arranged so as to see through a hole formed in the PCB, the hole in the PCB acting as a lens.

17. The PCB of claim 16, further comprising a plurality of ceramic legs formed on the light sensor flip-chip that include solder connection pins for connecting the flip to the PCB.

18. The PCB of claim 16, wherein light sensor operates free from any lenses apart from the hole in the PCB.

19. The PCB of claim 16, further comprising a plurality of light sensor arrays provided to the light sensor flip-chip,

wherein each said light sensor array is configured to sense a presence and intensity of light in a wavelength and to output the presence and intensity of light via a respective channel.

20. A vehicle window, comprising:

first and second substantially parallel spaced-apart glass substrates laminated together via a polymer-inclusive layer;

an opaque layer;

a printed circuit board (PCB) including a light sensor comprising a light sensor flip-chip, the light sensor flip-chip including at least two light sensor arrays, each said sensor array being configured to sense light of a predetermined wavelength; and

an adhesive for bonding the light sensor to the PCB,

wherein a hole is formed in the PCB and the opaque layer so as to allow the light sensor arrays to see through the hole formed in the PCB and the opaque layer,

wherein a state of the vehicle lights is settable in dependence on the light sensor, and

wherein the PCB is located in or is supported by the vehicle windshield.

21. The vehicle window of claim 20, wherein the light sensor of the PCB remains stable if the vehicle window or a component thereof reaches a temperature of about 120°

C.