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Substrate polishing metrology using interference signals

  • US 20080227367A1
  • Filed: 08/14/2007
  • Published: 09/18/2008
  • Est. Priority Date: 03/28/1995
  • Status: Active Grant
First Claim
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1. A method of polishing a substrate, comprising:

  • holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen;

    creating relative motion between the substrate and the polishing pad to polish a side of the substrate;

    generating a light beam;

    directing the light beam towards the substrate to cause the light beam to impinge on the side of the substrate being polished;

    receiving light reflected from the substrate at a detector to generate an interference signal; and

    computing a measure of uniformity from the interference signal.

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