PROCESS CONDITION SENSING WAFER AND DATA ANALYSIS SYSTEM
First Claim
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1. A device for monitoring processing conditions to be inserted by a robot hand into a sealed chamber, the device comprising:
- a first member comprising sensors;
a second member comprising electronics;
a conductive cable or conductors connecting the first and second members, wherein the first and second members fit into or onto a robot hand or hands, and wherein the device can be extended to a second position by the robot hand such that the first member is inside the sealed chamber and the second circular member is outside the chamber, thereby not subjecting the electronics of the second member to the conditions within the chamber.
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Abstract
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
74 Citations
15 Claims
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1. A device for monitoring processing conditions to be inserted by a robot hand into a sealed chamber, the device comprising:
- a first member comprising sensors;
a second member comprising electronics;
a conductive cable or conductors connecting the first and second members, wherein the first and second members fit into or onto a robot hand or hands, and wherein the device can be extended to a second position by the robot hand such that the first member is inside the sealed chamber and the second circular member is outside the chamber, thereby not subjecting the electronics of the second member to the conditions within the chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7)
- a first member comprising sensors;
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8. A process condition sensing wafer and data analysis system, comprising:
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an instrumented substrate having sensors that output sensor signal data; a data processing system that processes the sensor signal data that is output by the sensor; an electronics module that moves independently of the data processing system, the electronics module receiving the sensor signal data from the instrumented substrate, the electronics module subsequently passing the sensor signal data to the data processing system; and a physically continuous flexible connection between the electronics module and the instrumented substrate, the connection allowing relative movement of the electronics module with respect to the instrumented substrate. - View Dependent Claims (9, 10, 11, 12)
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13. A method of sensing and analyzing process conditions in a process environment, comprising:
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generating sensor signal data using one or more sensors attached to a substrate within the process environment; sending the sensor signal data from the sensors to an electronics module to be displaced from the substrate; and sensing the sensor signal data from the electronics modules to a data processing system, the electronics module moving separately from the data processing system. - View Dependent Claims (14, 15)
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Specification