Solid memory module structure with extensible capacity

• US 20080228994A1
• Filed: 05/04/2007
• Published: 09/18/2008
• Est. Priority Date: 03/14/2007
• Status: Abandoned Application

• Current Assignee: Endicott Interconnect Technologies Incorporated
• Original Assignee: Endicott Interconnect Technologies Incorporated
• Inventors: Lu, Li Hui, Liu, Kun Lin
• Application Number:
  US11/800,140
• Publication Number:
  US 20080228994A1
• Time in Patent Office: Days
• US Class Current: 711/102
• CPC Class Codes: G06F 3/0607 by facilitating the process of upgrading existing storage systems, e.g. for improving compatibility between host and storage device
• CPC Class Codes: G06F 3/0661 Format or protocol conversion arrangements
• CPC Class Codes: G06F 3/0688 Non-volatile semiconductor memory arrays

Abstract

A solid memory module structure with extensible capacity includes at least a non-volatile memory module, each of which has at least a memory chip, a first connector, and a control unit. And A Solid memory module includes at least a second connector, which electrically connects the first connector of the volatile memory module, and a system interfac3. The control unit of the non-volatile memory module obtains external signals by this system interface and then transmits to this non-volatile memory module by the control unit to store or use the memory content.

Claims

1. A solid memory module structure with extensible capacity, comprising:

At least a non-volatile memory module, each of which has at least a non-volatile memory chip, a first connector, and a control unit; and

A solid memory module including at least a second connector, which electrically connects the first connector of the volatile memory module, and a system interface, the control unit may obtains external signals by the system interface, and then transmitted to this non-volatile memory module by the control unit to store or use the memory content.

2. A solid memory module structure with extensible capacity according to claim 1, wherein this non-volatile memory chip is the Flash.

3. A solid memory module structure with extensible capacity according to claim 1, wherein the control unit of the non-volatile memory module includes a control chip and a frequency generator.

4. A solid memory module structure with extensible capacity according to claim 1, wherein the non-volatile memory chip, a first connector, and a control unit of non-volatile memory module are installed at a printing circuit board.

5. A solid memory module structure with extensible capacity according to claim 1, wherein the system interface and second connector of the solid are installed at a printing circuit board.

6. A solid memory module structure with extensible capacity according to claim 1, wherein the system interface includes a IDE RAID controller and the IDE to SATA conversion chip.

7. A solid memory module with extensible capacity according to claim 1, wherein the module includes a shell within which this solid memory module is installed.

8. A solid memory module with extensible capacity according to claim 7, wherein the shell is equipped with at least one slots, which can make the first connector of this non-volatile memory module inset into this slot, and is electrically connected with the second connector of this solid memory module.

9. A solid memory module with extensible structure capacity according to claim 8, wherein the slot has the first slider and this non-volatile memory is equipped with the second slider for sliding into this slot.

10. A solid memory module structure with extensible capacity, it is used for assembling more than one non-volatile memory module, which includes at least a memory chip, a first connector, and a control unit, the structure comprising:

At least one second connector used for connecting electrically with the first connector of the non-volatile memory module; and

A system interface; and

The control unit of the non-volatile may obtained external signals and then transmits to the non-volatile memory module by control unit to store or use the memory content by this system interface.

11. A solid memory module structure with extensible capacity according to claim 10, wherein the control unit includes a control chip and a frequency generator.

12. A solid memory module structure with extensible capacity according to claim 10, wherein the system interface and the second connector of the solid memory module are formed at a printing circuit board.

13. A solid memory module structure with extensible capacity according to claim 10, wherein the system interface at least includes the IDE RAID controller and the IDE to SATA conversion chip.

14. A solid memory module structure with extensible capacity according to claim 10, wherein the module includes a shell within which this solid memory module is installed.

15. A solid memory module structure with extensible capacity according to claim 14, wherein the shell is equipped with more than one slots, which can make the first connector of this non-volatile memory module inset into this slot, and is electrically connected with the second connector of this solid memory module.

16. A solid memory module structure with extensible capacity according to claim 15, wherein the slot has the first slider and this non-volatile memory is equipped with the second slider for sliding into this slot.