LAMINATED MAGNETIC CORES
First Claim
Patent Images
1. A method for forming a magnetic core comprising the steps of:
- stamping an amorphous metal strip with a high-velocity punch and die to create one or more laminates, the punch and die having a clearance based in part on a thickness of the amorphous metal strip;
grouping a pre-determined number of laminates in a stack; and
encapsulating the pre-determined number of stacked laminates in an electrically nonconductive container, the encased laminates forming a magnetic core.
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Abstract
Laminations to be stacked as magnetic cores are produced from a very thin amorphous metal strip, using a punch press with accurate punch/die clearance. The laminations are collected on conveyor spindles or a transport rod or pipe, in either case being arranged without the need for substantial handling. Heat annealing and anti-vibration treatments can be applied along a conveying path. The laminations are grouped in a stack to define a core and are packaged or encapsulated in electrically nonconductive coverings. The finished core has advantageous electrical characteristics and low cost.
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Citations
20 Claims
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1. A method for forming a magnetic core comprising the steps of:
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stamping an amorphous metal strip with a high-velocity punch and die to create one or more laminates, the punch and die having a clearance based in part on a thickness of the amorphous metal strip; grouping a pre-determined number of laminates in a stack; and encapsulating the pre-determined number of stacked laminates in an electrically nonconductive container, the encased laminates forming a magnetic core. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A system comprising:
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a punch press including a punch and die configured to stamp an amorphous metal sheet into one or more laminates, the punch and die having a clearance based in part on the thickness of the amorphous metal sheet; and an encapsulation apparatus configured to group the one or more laminates into a pre-determined number of laminates, the encapsulation apparatus further configured to encapsulate the pre-determined number of laminates in an electrically non-conductive container. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification