PRINTED CIRCUIT BOARD, DESIGN METHOD THEREOF AND MAINBOARD OF TERMINAL PRODUCT
First Claim
1. A method of designing a printed circuit board, comprising:
- wiring signal lines on an area basis at inner layers adjacent to outer surface layers;
arranging the outer surface layers with no wiring or with few wirings and interconnecting the outer surface layers through vias, so that the outer surface layers function as a primary ground; and
setting parameters of a line width and a layer height to control a target impedance value.
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Accused Products
Abstract
A printed circuit board and a design method thereof are disclosed. The design method includes: wiring signal lines on an area basis at inner layers adjacent to outer surface layers; arranging the outer surface layers with no wiring or few wirings and interconnecting the outer surface layers by way of through vias, so that the outer surface layers function as a primary ground; and setting parameters of a line width and a layer height to control a target impedance value. The printed circuit board includes outer surface layers and two inner layers therebetween. The inner layers adjacent to the outer surface layers are used for arranging signal lines on an area basis; and the outer surface layers are arranged with no wiring or few wirings and are interconnected as a primary ground through vias. The invention also discloses a mainboard of a terminal product using the printed circuit board.
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Citations
36 Claims
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1. A method of designing a printed circuit board, comprising:
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wiring signal lines on an area basis at inner layers adjacent to outer surface layers; arranging the outer surface layers with no wiring or with few wirings and interconnecting the outer surface layers through vias, so that the outer surface layers function as a primary ground; and setting parameters of a line width and a layer height to control a target impedance value. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A printed circuit board, comprising outer surface layers and at least one inner layer between the outer surface layers, wherein:
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the inner layer adjacent to the outer surface layers is used for arranging signal lines, and the signal lines are wired on an area basis at the inner layer; and the outer surface layers are arranged with no wiring or with few wirings and are interconnected as a primary ground through through vias. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A mainboard of a terminal product, comprising a core chip of a baseband or radio frequency module, wherein:
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the mainboard of the terminal product is a four-layer printed circuit board comprising surface layers and two inner layers between the surface layers; the surface layers comprises a top layer and a bottom layer which are respectively a primary reference ground layer consisted of a ground copper sheet with a large area, and the ground copper sheets with a large area of the top layer and the bottom layer are interconnected by way of through vias; and
the inner layers are primary wiring layers where wiring areas are divided by functions;a distance between the inner layers is above or equal to a distance between each of the surface layers and the inner layers adjacent to the surface layer; and the wiring area at each of the inner layers corresponds to the ground copper sheet area with a large area at a layer adjacent to the inner layer or vertically arranged traveling lines at the layer adjacent to the inner layer. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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Specification