HEAT BLOCK

• US 20080230531A1
• Filed: 08/27/2007
• Published: 09/25/2008
• Est. Priority Date: 03/20/2007
• Status: Abandoned Application

• Current Assignee: Orient Semiconductor Electronics Limited
• Original Assignee: Orient Semiconductor Electronics Limited
• Inventors: Su, Chen-Ping, Wang, Yu-Jen, Lin, Yu-Ping, Wang, Chao-Yung, CHOU, CHIH-MING
• Application Number:
  US11/845,626
• Publication Number:
  US 20080230531A1
• Time in Patent Office: Days
• US Class Current: 219/228
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/7825 Means for applying energy, e.g. heating means
• CPC Class Codes: H01L 2224/78703 Mechanical holding means
• CPC Class Codes: H01L 2224/78744 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H05B 3/22 non-flexible
• CPC Class Codes: H05K 9/0067 Devices for protecting against damage from electrostatic discharge

Abstract

A heat block for holding an electronic device is disclosed. The heat block comprises a base and at least one discharge device. The discharge device is disposed on the base. The discharge device is electrically conductive and is grounded. When the electronic device is placed on the base, the discharge device is in contact with an electrical contact of the electronic device.

Claims

1. A heat block for holding an electronic device, comprising:

a base;

at least one receiving hole formed on the base; and

at least one discharge device disposed in the receiving hole, wherein the discharge device is electrically conductive and grounded, and when the electronic device is placed on the base, the discharge device is in contact with an electrical contact of the electronic device.

2. The heat block as claimed in claim 1, wherein the discharge device comprises:

a discharge probe disposed in the receiving hole, wherein the discharge probe is electrically conductive; and

an elastic element disposed below the discharge probe for allowing the discharge probe to be movable corresponding to the electrical contact of the electronic device when the electronic device is placed on the base.

3. The heat block as claimed in claim 2, wherein the receiving hole is at least one blind hole.

4. The heat block as claimed in claim 1, wherein the discharge device comprises:

a socket disposed in the receiving hole;

a discharge probe disposed in the socket, wherein the discharge probe is electrically conductive; and

an elastic element disposed between the discharge probe and the socket for allowing the discharge probe to be movable corresponding to the electrical contact of the electronic device in the socket when the electronic device is placed on the base.

5. The heat block as claimed in claim 4, wherein the receiving hole is at least one through hole.

6. The heat block as claimed in claim 1, wherein the discharge device is disposed in the receiving hole, and the discharge device has a tip portion, and the tip portion is flexible and electrically conductive.

7. The heat block as claimed in claim 6, wherein the tip portion is made of electrically conductive plastic material.

8. The heat block as claimed in claim 1, wherein the base is mounted to a wire bonding equipment.

9. The heat block as claimed in claim 1, wherein the electronic device is a holder bonding with a chip.

10. The heat block as claimed in claim 9, wherein the holder is a circuit board flexible circuit board, or a substrate.

11. The heat block as claimed in claim 1, further comprising:

at least one vacuum hole disposed on the base and connected to a vacuum pump to attract the electronic device.

12. The heat block as claimed in claim 1, further comprising:

a hold down clamp for pressing the electronic device on the base.

13. The heat block as claimed in claim 1, wherein the base is made of high thermally conductive material.

14. A heat block for holding an electronic device, comprising:

a base; and

a discharge device disposed on the base, wherein the discharge devices is an electrically conductive plastic film and grounded, and when the electronic device is placed on the base, the discharge devices are in contact with an electrical contact of the electronic device.

15. The heat block as claimed in claim 14, wherein the electrically conductive plastic film has at least one protruding structure to touch the electrical contact of the electronic device.

16. A heat block for holding an electronic device, comprising:

a base; and

a plurality of receiving holes formed on base; and

a plurality of discharge devices disposed in the receiving holes, wherein the discharge devices are electrically conductive and grounded, and when the electronic device is placed on the base, the discharge devices are in contact with an electrical contact of the electronic device.

17. The heat block as claimed in claim 16, wherein each of the discharge devices comprises:

a discharge probe disposed in each of the receiving holes, wherein the discharge probe is electrically conductive; and

an elastic element disposed below the discharge probe for allowing the discharge probe to be movable corresponding to the electrical contact of the electronic device when the electronic device is placed on the base.

18. The heat block as claimed in claim 17, wherein each of the discharge devices further comprises:

a socket disposed in each of the receiving holes, wherein the elastic element and the discharge probe are received in the socket.