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Surface mount type light-emitting diode package device and light-emitting element package device

  • US 20080230796A1
  • Filed: 07/25/2007
  • Published: 09/25/2008
  • Est. Priority Date: 03/21/2007
  • Status: Active Grant
First Claim
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1. A surface mount type light-emitting diode package device, comprising:

  • a lead frame;

    at least one light-emitting diode chip disposed on the lead frame; and

    a light-pervious encapsulation layer disposed on the lead frame and encapsulating the light-emitting diode chip, wherein,the encapsulation layer has a bottom portion contacting the light-emitting diode chip and a top portion contacting an environmental ambiance, andthe encapsulation layer comprises at least one encapsulation material and at least one material having a refraction index different from the encapsulation material and distributed in the encapsulation material in a way such that the refraction index of the encapsulation layer is gradually reduced from the bottom portion upward to the top portion of the encapsulation layer.

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