Surface mount type light-emitting diode package device and light-emitting element package device
First Claim
1. A surface mount type light-emitting diode package device, comprising:
- a lead frame;
at least one light-emitting diode chip disposed on the lead frame; and
a light-pervious encapsulation layer disposed on the lead frame and encapsulating the light-emitting diode chip, wherein,the encapsulation layer has a bottom portion contacting the light-emitting diode chip and a top portion contacting an environmental ambiance, andthe encapsulation layer comprises at least one encapsulation material and at least one material having a refraction index different from the encapsulation material and distributed in the encapsulation material in a way such that the refraction index of the encapsulation layer is gradually reduced from the bottom portion upward to the top portion of the encapsulation layer.
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Accused Products
Abstract
The present invention discloses a surface mount type light-emitting diode package device and a light-emitting element package device. In the device, the encapsulation layer comprises an encapsulation material and at least one material having a refraction index different from the encapsulation material distributed therein. The distribution of the material having a refraction index different from the encapsulation material is in a way such that the refraction index of the encapsulation layer is gradually reduced from the bottom portion upward to the top portion or the inner portion outward to the outer portion of the encapsulation layer. Accordingly, a difference between the refraction indexes of two adjoining media can be reduced to eliminate a total reflection and the Fresnel loss and enhance light extraction efficiency.
19 Citations
16 Claims
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1. A surface mount type light-emitting diode package device, comprising:
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a lead frame; at least one light-emitting diode chip disposed on the lead frame; and a light-pervious encapsulation layer disposed on the lead frame and encapsulating the light-emitting diode chip, wherein, the encapsulation layer has a bottom portion contacting the light-emitting diode chip and a top portion contacting an environmental ambiance, and the encapsulation layer comprises at least one encapsulation material and at least one material having a refraction index different from the encapsulation material and distributed in the encapsulation material in a way such that the refraction index of the encapsulation layer is gradually reduced from the bottom portion upward to the top portion of the encapsulation layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A light-emitting element package device, comprising:
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a substrate; a light-emitting element disposed on the substrate; and a light-pervious encapsulation layer disposed on the substrate and encapsulating the light-emitting element, wherein, the encapsulation layer has an inner portion contacting the light-emitting element and an outer portion contacting an environmental ambiance, and the encapsulation layer comprises at least one encapsulation material and at least one material having a refraction index different from the encapsulation material and distributed in the encapsulation material in a way such that the refraction index of the encapsulation layer is gradually reduced from the inner portion outward to the outer portion of the encapsulation layer. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification