SEMICONDUCTOR PACKAGE AND THE METHOD OF MAKING THE SAME
First Claim
1. A method of making a semiconductor package, comprising the steps of:
- (a) providing a first substrate having a first surface and a second surface;
(b) mounting a first chip onto the first surface of the first substrate, the first chip being electrically connected to the first substrate;
(c) forming a plurality of conductive elements on the first surface of the first substrate;
(d) covering the conductive elements with a mold, the mold having a plurality of cavities accommodating top ends of each of the conductive elements; and
(e) forming a first molding compound for encapsulating the first surface of the first substrate, the first chip and parts of the conductive elements, wherein the height of the first molding compound is smaller than the height of each of the conductive elements.
1 Assignment
0 Petitions
Accused Products
Abstract
The present invention relates to semiconductor package and the method of making the same. The method of the invention comprises the following steps: (a) providing a first substrate; (b) mounting a first chip onto a surface of the first substrate; (c) forming a plurality of conductive elements on the surface of the first substrate; (d) covering the conductive elements with a mold, the mold having a plurality of cavities accommodating top ends of each of the conductive elements; and (e) forming a first molding compound for encapsulating the surface of the first substrate, the first chip and parts of the conductive elements, wherein the height of the first molding compound is smaller than the height of each of the conductive elements. Thus, the first molding compound encapsulates the entire surface of the first substrate, so that the mold flush of the first molding compound will not occur, and the rigidity of the first substrate is increased.
375 Citations
13 Claims
-
1. A method of making a semiconductor package, comprising the steps of:
-
(a) providing a first substrate having a first surface and a second surface; (b) mounting a first chip onto the first surface of the first substrate, the first chip being electrically connected to the first substrate; (c) forming a plurality of conductive elements on the first surface of the first substrate; (d) covering the conductive elements with a mold, the mold having a plurality of cavities accommodating top ends of each of the conductive elements; and (e) forming a first molding compound for encapsulating the first surface of the first substrate, the first chip and parts of the conductive elements, wherein the height of the first molding compound is smaller than the height of each of the conductive elements. - View Dependent Claims (2, 3, 4)
-
-
5. A semiconductor package, comprising:
-
a first substrate, having a first surface and a second surface; a first chip, mounted onto the first surface of the first substrate and electrically connected to the first substrate; a plurality of conductive elements, disposed on the first surface of the first substrate; and a molding compound, encapsulating the first surface of the first substrate, the first chip and parts of the conductive elements, wherein the height of the first molding compound is smaller than the height of each of the conductive elements.
-
-
6. A semiconductor package, comprising:
-
a first substrate, having a first surface and a second surface; a first chip, mounted onto the first surface of the substrate, and electrically connected to the first substrate; a second substrate, having a first surface and a second surface; a second chip, mounted onto the first surface of the second substrate, electrically connected to the second substrate; a plurality of fourth solder balls, connecting the second surface of the second substrate and the first surface of the first substrate; and a first molding compound, encapsulating the first surface of the substrate, the first chip and parts of the fourth solder balls, wherein the height of the first molding compound is smaller than the height of each of the fourth solder balls.
-
-
7. A method of making a semiconductor package, comprising the steps of:
-
(a) providing a first substrate having a first surface and a second surface; (b) mounting a first chip onto the first surface of the substrate, the first chip being electrically connected to the first substrate; (c) forming a plurality of conductive elements on the first surface of the first substrate; (d) covering the conductive elements with a mold, the mold having a plurality of protrusions contacting top ends of each of the conductive elements; and (e) forming a first molding compound for encapsulating the first surface of the first substrate, the first chip and parts of the conductive elements, wherein the height of the first molding compound is greater than the height of each of the conductive elements, and the first molding compound has a plurality of cavities to expose top ends of the conductive elements. - View Dependent Claims (8, 9, 10, 11, 12)
-
-
13. A semiconductor package, comprising:
-
a first substrate, having a first surface and a second surface; a first chip, mounted onto the first surface of the first substrate and electrically connected to the first substrate; a plurality of conductive elements, disposed on the first surface of the first substrate; and a first molding compound, encapsulating the first surface of the first substrate, the first chip and parts of the conductive elements, wherein the height of the first molding compound is greater than the height of each of the conductive elements, and the first molding compound has a plurality of cavities to expose top ends of the conductive elements.
-
Specification