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SEMICONDUCTOR PACKAGE AND THE METHOD OF MAKING THE SAME

  • US 20080230887A1
  • Filed: 03/21/2008
  • Published: 09/25/2008
  • Est. Priority Date: 03/23/2007
  • Status: Active Grant
First Claim
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1. A method of making a semiconductor package, comprising the steps of:

  • (a) providing a first substrate having a first surface and a second surface;

    (b) mounting a first chip onto the first surface of the first substrate, the first chip being electrically connected to the first substrate;

    (c) forming a plurality of conductive elements on the first surface of the first substrate;

    (d) covering the conductive elements with a mold, the mold having a plurality of cavities accommodating top ends of each of the conductive elements; and

    (e) forming a first molding compound for encapsulating the first surface of the first substrate, the first chip and parts of the conductive elements, wherein the height of the first molding compound is smaller than the height of each of the conductive elements.

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