×

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

  • US 20080232673A1
  • Filed: 03/18/2008
  • Published: 09/25/2008
  • Est. Priority Date: 03/19/2007
  • Status: Active Grant
First Claim
Patent Images

1. A method for manufacturing an electronic device, comprising:

  • pressure-bonding a plurality of terminals of an electronic component to a plurality of electrodes formed on a surface of a transparent substrate, respectively, via an anisotropic conductive film to mount the electronic component on the transparent substrate;

    obtaining an image of the electrodes by imaging the transparent substrate with the electronic component mounted thereon from backside of the transparent substrate;

    measuring the number of indentations for each said electrode using the image of the electrode, the indentation being formed when the electrode is pressed by a conductive particle in the anisotropic conductive film;

    calculating an average and a standard deviation of the number of indentations per electrode throughout the transparent substrate; and

    calculating a probability that the number of indentations per electrode is less than a reference value on basis of the average and the standard deviation.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×