METHOD FOR MANUFACTURING ELECTRONIC DEVICE
First Claim
1. A method for manufacturing an electronic device, comprising:
- pressure-bonding a plurality of terminals of an electronic component to a plurality of electrodes formed on a surface of a transparent substrate, respectively, via an anisotropic conductive film to mount the electronic component on the transparent substrate;
obtaining an image of the electrodes by imaging the transparent substrate with the electronic component mounted thereon from backside of the transparent substrate;
measuring the number of indentations for each said electrode using the image of the electrode, the indentation being formed when the electrode is pressed by a conductive particle in the anisotropic conductive film;
calculating an average and a standard deviation of the number of indentations per electrode throughout the transparent substrate; and
calculating a probability that the number of indentations per electrode is less than a reference value on basis of the average and the standard deviation.
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Accused Products
Abstract
A method for manufacturing an electronic device is provided. The method includes: pressure-bonding a plurality of terminals of an electronic component to a plurality of electrodes formed on a surface of a transparent substrate, respectively, via an anisotropic conductive film to mount the electronic component on the transparent substrate; obtaining an image of the electrodes by imaging the transparent substrate with the electronic component mounted thereon from backside of the transparent substrate; measuring the number of indentations for each said electrode using the image of the electrode, the indentation being formed when the electrode is pressed by a conductive particle in the anisotropic conductive film; calculating an average and a standard deviation of the number of indentations per electrode throughout the transparent substrate; and calculating a probability that the number of indentations per electrode is less than a reference value on basis of the average and the standard deviation.
12 Citations
20 Claims
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1. A method for manufacturing an electronic device, comprising:
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pressure-bonding a plurality of terminals of an electronic component to a plurality of electrodes formed on a surface of a transparent substrate, respectively, via an anisotropic conductive film to mount the electronic component on the transparent substrate; obtaining an image of the electrodes by imaging the transparent substrate with the electronic component mounted thereon from backside of the transparent substrate; measuring the number of indentations for each said electrode using the image of the electrode, the indentation being formed when the electrode is pressed by a conductive particle in the anisotropic conductive film; calculating an average and a standard deviation of the number of indentations per electrode throughout the transparent substrate; and calculating a probability that the number of indentations per electrode is less than a reference value on basis of the average and the standard deviation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for testing an electronic device including a transparent substrate and an electronic component mounted on the transparent substrate by pressure-bonding a plurality of terminals of the electronic component to a plurality of electrodes formed on a surface of the transparent substrate, respectively, via an anisotropic conductive film, comprising;
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obtaining an image of the electrodes by imaging the transparent substrate with the electronic component mounted thereon from backside of the transparent substrate; measuring the number of indentations for each said electrode using the image of the electrode, the indentation being formed when the electrode is pressed by a conductive particle in the anisotropic conductive film; calculating an average and a standard deviation of the number of indentations per electrode throughout the transparent substrate; and calculating a probability that the number of indentations per electrode is less than a reference value on basis of the average and the standard deviation. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification