Light emitting diode package with metal reflective layer and method of manufacturing the same
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Abstract
The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, and an encapsulant covering the LED chip and the substrate to protect the LED chip. The LED package also includes a metal reflective layer surrounding side surfaces of the encapsulant to form a light transmitting surface on a top surface of the encapsulant. The invention minimizes light loss, improves luminance, can be mass-produced as a PCB type, and adopts EMC transfer molding to minimize irregular color distribution, thereby improving optical quality.
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Citations
14 Claims
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1-5. -5. (canceled)
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6. A method of manufacturing a light emitting diode package for emitting light from a light emitting diode chip in one direction, comprising steps of:
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providing a substrate with an electrode formed thereon; disposing a light emitting diode chip on the substrate; forming an encapsulant on the light emitting diode chip and the substrate; cutting the encapsulant; and forming a reflective layer on the encapsulant. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14)
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Specification