APPARATUSES AND METHODS FOR FORMING SMART LABELS

• US 20080235940A1
• Filed: 05/01/2008
• Published: 10/02/2008
• Est. Priority Date: 08/17/2001
• Status: Abandoned Application

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Inventors: Jacobsen, Jeffrey Jay
• Application Number:
  US12/113,891
• Publication Number:
  US 20080235940A1
• Time in Patent Office: Days
• US Class Current: 29/832
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/1306 Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H10K 2102/311 : Flexible OLED
• CPC Class Codes: H10K 59/12 : Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/129 : Chiplets
• CPC Class Codes: H10K 71/00 : Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 77/111 : Flexible substrates
• CPC Class Codes: Y02E 10/549 : Organic PV cells
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Apparatuses and methods for forming displays are claimed. This invention relates to a display which may be conformal and which can receive information in order to alter or configure the display. In one embodiment, a flexible layer may be made to receive an array of blocks which drive a display material to provide an alterable or configurable display. This display is coupled to a receiver which receives data and drives the data onto the blocks causing the display to change. The receiver (and blocks) may be powered by a signal from a transmitter which beams the information to the receiver. The receiver in turn controls the update of the display information on the display. Another embodiment of the invention has a receiver coupled to each block. The receiver also may be independent from the block and may be deposited onto the flexible layer.

Claims

1. A method for manufacturing of an apparatus comprising:

disposing a plurality of metallization patterns on a web material, the length to width ratio of the web material being greater than 10;

1;

robotically placing a plurality of radio frequency (RF) transponder chips onto the web material, each of the RF transponder chips respectively coupled to at least one of the metallization patterns; and

after the disposing and the robotically placing, separating the web material to form assemblies, each of the assemblies including a single RF transponder chip,

wherein each of the RF transponder chips are configured to be powered by a signal from a transmitter and to store a security code.

2. The method of claim 1 wherein the metallization patterns comprise silver particles.

3. The method of claim 1 further comprising applying an adhesive to the web material.

4. The method of claim 1 wherein the RF transponder chips are noncontact devices.

5. The method of claim 1 further comprising coupling the web material to a second web material.

6. The method of claim 1 wherein the ratio is greater than 50:

1.

7. The method of claim 1 wherein the apparatus comprises a display, the display configured to display information related to a retail product.

8. The method of claim 7 wherein the apparatus further comprises a controller configured to control the information on the display.

9. The method of claim 1 wherein the apparatus comprises a flexible antenna.