LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING
First Claim
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1. A heat spreader to cool a device, comprising:
- first and second opposing proximal surfaces defining a chamber containing a liquid therein; and
one or more structures mounted in the chamber to induce a liquid flow pattern during boiling of the liquid to cool the device.
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Abstract
Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat.
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Citations
39 Claims
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1. A heat spreader to cool a device, comprising:
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first and second opposing proximal surfaces defining a chamber containing a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during boiling of the liquid to cool the device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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Specification