Power core devices and methods of making thereof

• US 20080236877A1
• Filed: 04/02/2007
• Published: 10/02/2008
• Est. Priority Date: 04/02/2007
• Status: Active Grant

• Current Assignee: Chemtron Research LLC (Intellectual Ventures LLC)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: Borland, William, Amey, Daniel I.
• Granted Patent: US 7,902,662 B2
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19015 including thin film passive components
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/114 Pad being close to via, but not surrounding the via
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/09763 Printed component having superposed conductors, but integrated in one circuit layer
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 3/4688 Composite multilayer circuits, i.e. comprising insulating layers having different properties having a special base or central core H05K3/4602
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a second electrode and wherein said embedded singulated capacitor is positioned on the outer layer of the power core so that at least one Vcc (power) terminal and at least one Vss (ground) terminal of a semiconductor device can be directly connected to at least one first and at least one second electrode, respectively and wherein the first and second electrode of the singulated capacitor is interconnected to the first and second electrode respectively of an external planar capacitor embedded within a printed wiring motherboard.

Claims

1. A printed wiring board device comprising a power core having an outer layer, said power core comprising at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first embedded singulated capacitor electrode and a second embedded singulated capacitor electrode and wherein said embedded singulated capacitor is positioned on said outer layer of said power core and wherein said first embedded singulated capacitor electrode and said second embedded singulated capacitor electrode are directly connected to at least one Vcc (power) terminal and at least one Vss (ground) terminal, respectively, of a semiconductor device and wherein said first embedded singulated capacitor electrode and said second embedded singulated capacitor electrode are interconnected to a first external planar capacitor electrode and a second external planar capacitor electrode, respectively of an external planar capacitor embedded within a printed wiring motherboard and wherein said printed wiring motherboard serves to supply a charge to said embedded singulated capacitor.

2. The printed wiring board device of claim 1 wherein said semiconductor device is a microprocessor.

3. The printed wiring board device of claim 1 wherein said power core is interconnected to at least one signal layer.

5. The printed wiring board device of claim 3 wherein signal layers are formed by etching the capacitor foil or by incorporation of additional metal layers within the power core.

6. The method of claim 5 wherein said interconnection between layers is a conductive via.

7. The printed wiring board device of any one of claims 1 through 3 wherein additional passive components are connected to and external to said power core.

4. A method for making a printed wiring board device comprising:

providing at least one foil structure comprising at least one fired-on-foil singulated capacitor having a foil side and a component side; and

laminating said component side of said foil structure to a printed wiring board core;

etching said foil side of said foil structure; and

forming microvias and pads to allow connection of said singulated capacitors to a planar capacitor in a mother board.