Microelectromechanical systems, and methods for encapsualting and fabricating same
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Abstract
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.
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Citations
70 Claims
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1-20. -20. (canceled)
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21. A microelectromechanical device comprising:
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a substrate; a chamber; a micromachined mechanical structure at least partially disposed in the chamber; a first encapsulation layer comprising a permeable material having a plurality of pores, wherein; the first encapsulation layer is disposed over both the micromachined mechanical structure and the substrate, and the first encapsulation layer forms at least a portion of a wall of the chamber; and a second encapsulation layer comprising a semiconductor material disposed over the first encapsulation layer and sealing the chamber by filling the plurality of pores, wherein; a portion of the second encapsulation layer having been removed to expose a substantially planar surface, and the substantially planar surface is adapted to provide a base upon which integrated circuits are formed. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A method of manufacturing a microelectromechanical device, the method comprising:
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forming a micromachined mechanical structure on top of a substrate; providing a sacrificial layer over the micromachined mechanical structure; disposing a first encapsulation layer over the sacrificial layer, wherein the first encapsulation layer; comprises a permeable material having a plurality of pores; and is disposed over both the micromachined mechanical structure and the substrate; removing the sacrificial layer through the plurality of pores to release at least a portion of the micromachined mechanical structure, thereby forming a chamber, wherein; a surface of the first encapsulation layer forms a wall of the chamber, and at least a portion of the micromachined mechanical structure is disposed in the chamber; disposing a second encapsulation layer over the first encapsulation layer to fill the plurality of pores, thereby sealing the chamber, wherein the second encapsulation layer comprises a semiconductor material; removing a portion of the second encapsulation layer to expose a substantially planar surface; and forming integrated circuits on the substantially planar surface. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. A microelectromechanical device comprising:
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a substrate; a chamber; a micromachined mechanical structure at least partially disposed in the chamber; a first encapsulation layer comprising a material having a plurality of vents, wherein; the first encapsulation layer is disposed over both the micromachined mechanical structure and the substrate, and the first encapsulation layer forms at least a portion of a wall of the chamber; and a second encapsulation layer comprising a semiconductor material disposed over the first encapsulation layer and sealing the chamber by filling the plurality of vents, wherein; a portion of the second encapsulation layer having been removed to expose a substantially planar, and the substantially planar surface is adapted to provide a base upon which integrated circuits are formed. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54, 55, 56)
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57. A method of manufacturing a microelectromechanical device, the method comprising:
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forming a micromachined mechanical structure on top of a substrate; providing a sacrificial layer over the micromachined mechanical structure; disposing a first encapsulation layer over the sacrificial layer, the micromachined mechanical structure, and the substrate; forming a plurality of vents in the first encapsulation layer; removing the sacrificial layer through the plurality of vents to release at least a portion of the micromachined mechanical structure, thereby forming a chamber, wherein; a surface of the first encapsulation layer forms a wall of the chamber, and at least a portion of the micromachined mechanical structure is disposed in the chamber; disposing a second encapsulation layer over the first encapsulation layer to fill the plurality of vents, thereby sealing the chamber, wherein the second encapsulation layer comprises a semiconductor material; removing a portion of the second encapsulation layer to expose a substantially planar; and forming integrated circuits on the substantially planar surface. - View Dependent Claims (58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70)
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Specification